Stage Unit, Exposure Apparatus, and Exposure Method

ABSTRACT

A power usage supply unit that supplies power usage to a stage which moves on a movement surface has a first axis section, first support sections, a second axis section, and a second support section. The first axis section is movably supported by the first support section in a direction of the first axis and around the first axis, and the second axis and around the second axis. And, by employing a mechanism in which the power usage supply unit has at least four degrees of freedom, the power usage supply unit does not interfere with the movement of a stage even when the stage moves in the first and second axis directions and in the rotational direction of each axis, therefore, decrease in position controllability of the stage caused by dragging a tube can be completely avoided.

TECHNICAL FIELD

The present invention relates to stage units, exposure apparatus, andexposure methods, and more particularly to a stage unit (stage device)that has a stage which moves on a movement surface, an exposureapparatus that is equipped with the stage unit, and an exposure methodin which a pattern is formed by exposing a substrate on the stage.

BACKGROUND ART

In recent years, in a lithographic process to produce a semiconductor, aliquid crystal display device or the like, due to higher integration ofsemiconductors or the like, the sequentially moving type exposureapparatus is mainly used, such as the reduction projection exposureapparatus based on a step-and-repeat method (the so-called stepper) thatcan form a fine pattern on a photosensitive object with good accuracyand high throughput, the scanning projection exposure apparatus based ona step-and-scan method (the so-called scanning stepper (also called ascanner)) or the like.

In these types of exposure apparatus, as a drive unit for driving aphotosensitive object such as a wafer or a glass plate (hereinafterreferred to as a “wafer”), a wafer stage unit of a coarse/fine movementstructure has been used, which has an XY stage supported by levitationby air bearings or the like on a platform and is driven within atwo-dimensional plane by a two-axis linear motor, and a wafer table thatholds a wafer on the XY stage and is finely driven in a Z-axis directionand a direction of inclination by voice coil motors or the like.Further, a wafer stage unit that is equipped with a single stage drivenin directions of six degrees of freedom by linear motors or voice coilmotors is also recently being developed.

However, in the wafer stage units referred to above, because wiring usedin the linear motors or voice coil motors, piping (tubes) used in theair bearings or the like connects from the outside to the stage, thewiring, piping or the like was dragged along with the drive of thestage, which caused a decrease in position controllability of the wafer.

In order to improve such an inconvenience, for example, a moving magnettype linear motor can be used for driving the stage and pressurized gasfor supporting the stage on the platform by levitation can also besupplied from the platform side, which allows the wiring, piping or thelike connecting to the stage to be removed (for example, refer to PatentDocument 1).

However, although it is relatively easy to employ the structureaccording to Patent Document 1 in which pressurized gas is supplied fromthe platform side to the stage side in a stage which is scanned in anuniaxial direction (e.g. scanning direction) such as in a reticle stagein the scanner, it is difficult to employ the structure in a wafer stageto which two-dimensional movement is essential. Therefore, in a waferstage unit, the piping for supplying pressurized gas had to be connectedto the stage, which left the piping dragging and still being a cause inthe decrease in position controllability of the stage. As a matter ofcourse, in the case piping inevitably has to be connected to the reticlestage also in a reticle stage unit, there is a similar risk of adecrease in position controllability.

Patent Document 1: Kokai (Japanese Unexamined Patent ApplicationPublication) No. 2001-20951

DISCLOSURE OF INVENTION Means for Solving the Problems

The present invention was made under the circumstances described above,and according to a first aspect of the present invention, there isprovided a first stage unit that has a stage which moves on a movementsurface and a power usage supply unit which supplies power usage to thestage wherein the power usage supply unit comprises: a first axissection that extends in a direction of a first axis within the movementsurface; a first support section that movably supports the first axissection in the direction of the first axis and around the first axis; asecond axis section that extends in a direction of a second axisintersecting with the first axis; and a second support section thatmovably supports the second axis section in the direction of the secondaxis and around the second axis.

According to this unit, the power usage supply unit which supplies powerusage to the stage that moves on the movement surface comprises thefirst axis section, the first support section, the second axis section,and the second support section, and the first axis section is movablysupported by the first support section within the movement surface inthe direction of the first axis and around the first axis, while thesecond axis section is movably supported by the second support sectionwithin the movement surface in the direction of the second axisintersecting with the first axis and around the second axis.Accordingly, even if a force in a direction of the four degrees offreedom (the direction of the first axis, the rotational directionaround the first axis, the direction of the second axis, and therotational direction around the second axis) acts on the power usagesupply unit due to the movement of the stage, the power usage supplyunit absorbs the force by changing its position and attitude accordingto the force. Therefore, by connecting the power usage supply unit tothe stage, the position controllability does not decrease due todragging a tube as in the case when piping such as a tube are used forsupplying power usage, and the position controllability of the stage canbe favorably secured.

In this case, the power usage supply unit can further comprise: a thirdaxis section that extends in a direction of a third axis intersectingwith the first axis and the second axis; and a third support sectionthat movably supports the third axis section in the direction of thethird axis and around the third axis. In such a case, even if a force inany direction acts on the power usage supply unit, because the powerusage supply unit can change its position and attitude according to theforce, the position controllability of the stage can be secured morefavorably.

According to a second aspect of the present invention, there is provideda second stage unit, the unit comprising: a stage movably supported on amovement surface; a first drive unit that drives the stage; a countermass that moves in an opposite direction of the stage by the reactionforce caused when the first drive unit drives the stage; and a powerusage supply unit that supplies power usage to the stage via the countermass.

According to this unit, the stage movably supported on the movementsurface comprises the power usage supply unit that supplies power usageto the stage via the counter mass that moves in the opposite directionof the stage by the reaction force caused when the first drive unitdrives the stage. Therefore, the power usage supply to the stage isperformed relaying the counter mass located near the stage. Accordingly,when comparing the case with when the power usage (fluid) is supplied tothe stage directly from outside the stage unit via piping such as tubes,the resisting force that accompanies the dragging of a tube can bereduced, which makes it possible to improve the position controllabilityof the stage.

According to a third aspect of the present invention, there is provideda first exposure apparatus that transfers a pattern of a mask mounted ona stage unit onto a substrate wherein a stage unit according to one ofthe first and second stage units is used as the stage unit.

According to this apparatus, one of the first and second stage units isused as the stage unit that moves the mask, therefore, the positioncontrollability of the mask can be improved, and as a consequence,position alignment (or overlay) of the pattern formed on the mask andthe substrate becomes favorable, and it becomes possible to transfer thepattern onto the substrate with high precision.

According to a fourth aspect of the present invention, there is provideda second exposure apparatus that forms a pattern by exposing a substratemounted on a stage unit wherein a stage unit according to one of thefirst and second stage units is used as the stage unit.

According to this apparatus, one of the first and second stage units ofthe present invention is used as the stage unit that moves thesubstrate, therefore, the position controllability of the substrate canbe improved, and as a consequence, it becomes possible to transfer thepattern onto the substrate with high precision.

According to a fifth aspect of the present invention, there is providedan exposure method in which a pattern is formed by exposing a substrateon a stage with a unit comprising a power usage supply unit thatsupplies power usage to the stage which moves within a two dimensionalplane wherein the power usage supply unit is moved in a first axisdirection within the two dimensional plane and also around the firstaxis, and the power usage supply unit is moved in a second axisdirection intersecting with the first axis and also around the secondaxis.

According to this method, the power usage supply unit that suppliespower usage to the stage which moves within the two dimensional planemoves in directions of four degrees of freedom (the direction of thefirst axis, the rotational direction around the first axis, thedirection of the second axis, and the rotational direction around thesecond axis), which allows the power usage supply unit to follow thestage when it moves. Therefore, the position controllability does notdecrease due to dragging a tube as in the case when piping such as tubesare used for supplying power usage, and the position controllability ofthe stage can be favorably secured, which makes it possible to increasethe exposure accuracy.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic view of an arrangement of an exposure apparatusrelated to a first embodiment;

FIG. 2 is a perspective view of a wafer stage unit 12 in FIG. 1;

FIG. 3A is a perspective view of a wafer stage;

FIG. 3B is a view that shows a state in which the wafer stage in FIG. 3Ais engaged with a stator that constitutes a moving body unit;

FIG. 4 is a planar view of wafer stage unit 12;

FIG. 5 is an XZ sectional view of a component part including a statorunit MY, a wafer stage WST movably engaged with stator unit MY, and atube carrier TC;

FIG. 6 is a view that models forces generated within the wafer stageunit;

FIG. 7 is a perspective view that schematically shows the innerarrangement of a Y linear motor;

FIG. 8 is a block diagram of a control system in the first embodiment;

FIG. 9 is a perspective view that shows a state of a power usage supplyunit related to the first embodiment attached to the wafer stage;

FIG. 10 is a perspective view that shows the power usage supply unitrelated to the first embodiment;

FIG. 11 is an exploded perspective view that shows the power usagesupply unit related to the first embodiment;

FIG. 12A is a YZ sectional view of the power usage supply unit relatedto the first embodiment;

FIG. 12B is an enlarged sectional view of a first solid cylindricalmember and a hollow cylindrical member;

FIG. 13 is a perspective view of a wafer stage unit 12′ related to asecond embodiment;

FIG. 14A is a perspective view of a counter mass and a wafer stageattached to the counter mass extracted from wafer stage unit 12′ in FIG.13;

FIG. 14B is an XY sectional view of a component part in FIG. 14A;

FIG. 15 is a planar view of wafer stage unit 12′ in a state where thewafer table is detached;

FIG. 16 is a perspective view that shows a power usage supply unitrelated to a modified example;

FIG. 17 is an exploded perspective view of the power usage supply unitin FIG. 16;

FIG. 18 is a partially sectioned view (No. 1) of the power usage supplyunit;

FIG. 19 is a partially sectioned view (No. 2) of the power usage supplyunit;

FIG. 20 is a view (No. 1) for describing a gas flow within the powerusage supply unit;

FIG. 21 is a view (No. 2) for describing a gas flow within the powerusage supply unit; and

FIG. 22 is a sectional view of a wafer stage and a counter mass in astate where the power usage supply unit related to the modified exampleis incorporated.

BEST MODE OF CARRYING OUT THE INVENTION A First Embodiment

A first embodiment of the present invention is described below,referring to FIGS. 1 to 12B.

FIG. 1 is an entire view of an arrangement of an exposure apparatus 100related to the first embodiment. Exposure apparatus 100 is a scanningexposure apparatus based on a step-and-scan method, that is, theso-called scanning stepper.

Exposure apparatus 100 is equipped with an illumination system 10 thatincludes a light source and an illumination optical system andilluminates an illumination light (exposure light) IL serving as anenergy beam on a reticle R serving as a mask, a reticle stage RST thatholds reticle R, a projection unit PU, a wafer stage unit 12 serving asa stage unit (stage device) that includes a wafer stage WST on which awafer W serving as an object is mounted, a body BD in which reticlestage RST and projection unit PU is installed, a control system forthese parts and the like.

Illumination system 10 illuminates a slit-shaped illumination area setby a reticle blind (not shown) on reticle R with illumination light ILat a substantially uniform illuminance. In this case, for example, anArF excimer laser beam (wavelength: 193 nm) is used as illuminationlight IL.

Reticle stage RST is supported by levitation above a reticle base 36that constitutes a top plate of a second column 34 which will bedescribed later, by air bearings or the like (not shown) arranged on thebottom surface of reticle stage RST via a clearance of, for example,around several aim. On reticle stage RST, reticle R is fixed, forexample, by vacuum suction (or by electrostatic suction). In this case,reticle stage RST can be finely driven two dimensionally within an XYplane (in an X-axis direction, a Y-axis direction and a rotationaldirection (θz direction) around a Z-axis orthogonal to the XY plane)perpendicular to an optical axis AX of a projection optical system PL(to be described later) by a reticle stage drive section 11, whichincludes a linear motor or the like, and can also be driven on reticlebase 36 in a predetermined scanning direction (in this case, the Y-axisdirection which is the lateral direction of the page surface in FIG. 1)at a designated scanning speed. Reticle stage RST can employ the knowncoarse/fine movement structure.

In the case of the embodiment, measures are taken to reduce theinfluence of vibration due to reaction forces acting on stators of thelinear motor when reticle stage RST is driven (especially duringscanning drive) as much as possible. More specifically, as is disclosedin, for example, Kokai (Japanese Patent Unexamined ApplicationPublication) No. 8-330224, the corresponding U.S. Pat. No. 5,874,820 andthe like, the stators of the linear motor are each supported by asupport member (a reaction frame) (not shown) arranged separately frombody BD, and the reaction forces that act on the stators of the linearmotor when reticle stage RST is driven is to be transmitted (released)to a floor surface F of the clean room via the reaction frame. Besidessuch a method, a reaction canceling mechanism that uses the law ofconservation of momentum as is disclosed in, for example, Kokai(Japanese Unexamined Patent Application Publication) No. 08-63231 andthe corresponding U.S. Pat. No. 6,246,204 and the like, can also beemployed as the reaction canceling mechanism of reticle stage RST. Aslong as the national laws in designated states (or elected states), onwhich this international application is applied, permit, the abovedisclosures of each of the publications and their corresponding U.S.Patents are incorporated herein by reference.

The position of reticle stage RST within a stage movement surface isconstantly detected by a reticle laser interferometer (hereinafterreferred to as “reticle interferometer”) 16 via a movable mirror 15 at aresolution of, for example, around 0.5 to 1 nm. In this case, positionmeasurement is performed, with a fixed mirror 14 fixed to the sidesurface of a barrel 40 that makes up projection unit PU serving as areference. On reticle stage RST, a Y movable mirror that has areflection surface orthogonal to the Y-axis direction and an X movablemirror that has a reflection surface orthogonal to the X-axis directionare actually arranged, and a reticle Y interferometer and a reticle Xinterferometer are also arranged corresponding to the movable mirrors,and furthermore, corresponding to the interferometers, a fixed mirrorfor position measurement in the X-axis direction and a fixed mirror forposition measurement in the Y-axis direction are arranged, however, inFIG. 1 these are representatively indicated as movable mirror 15,reticle interferometer 16, and fixed mirror 14.

The measurement values of reticle interferometer 16 are sent to a maincontroller 20. Main controller 20 drives and controls reticle stage RSTvia reticle stage drive section 11, based on the measurement values ofreticle interferometer 16.

Projection unit PU is held by a part of body BD, below reticle stage RSTin FIG. 1. Body BD is equipped with a first column 32 arranged on aframe caster FC placed on floor surface F of the clean room and thesecond column 34 fixed on the first column 32.

Frame caster FC is equipped with a base plate BS laid horizontally onfloor surface F, and a plurality of, e.g. three (or four), leg sections39 (however, the leg section in the depth of the page surface of FIG. 1is omitted in the drawings) fixed on base plate BS.

The first column 32 is equipped with a barrel platform (main frame) 38,which is supported substantially horizontally by a plurality of, e.g.three (or four), first vibration isolation mechanisms 56 fixedindividually on the upper end of the plurality of leg sections 39 thatconstitutes frame caster FC.

In barrel platform 38, a circular opening (not shown) is formedsubstantially in the center, and in the circular opening, projectionunit PU is inserted from above and is held via a flange FLG arranged onthe outer circumferential section. On the upper surface of barrelplatform 38, at positions surrounding projection unit PU, one end (thelower end) of a plurality of, e.g. three (or four), legs 41 (however,the leg in the depth of the page surface of FIG. 1 is omitted in thedrawings) is fixed. The other end (the upper end) of these legs 41 issubstantially flush on a horizontal surface, and on each of the upperend surface of legs 41, the lower surface of reticle base 36 describedearlier is fixed. In the manner described above, the plurality of legs41 horizontally supports reticle base 36. That is, the second column 34is configured by reticle base 36 and legs 41 supporting reticle base 36.In reticle base 36, an opening 36 a, which serves as a path forillumination light IL, is formed in the center.

Projection unit PU is configured by barrel 40 that has a cylinder hollowshape and has flange FLG arranged on the outer periphery in the vicinityof the lower end section, and projection optical system PL consisting ofa plurality of optical elements held in barrel 40.

As projection optical system PL, for example, a dioptric system is usedconsisting of a plurality of lenses (lens elements) that share opticalaxis AX in the Z-axis direction. Projection optical system PL is, forexample, a both-side telecentric dioptric system that has apredetermined projection magnification (such as one-quarter or one-fifthtimes). Therefore, when illumination light IL from illumination system10 illuminates the illumination area on reticle R with illuminationlight IL that has passed through reticle R, a reduced image of thecircuit pattern within the illumination area of reticle R (a partialreduced image of the circuit pattern) is formed on wafer W whose surfaceis coated with a resist (a photosensitive agent) via projection opticalsystem PL. Wafer W is, for example, a disc-shaped substrate such as asemiconductor (silicon or the like) or an SOI (Silicon Insulator), and aresist is coated on the substrate.

As is shown in the perspective view in FIG. 2, wafer stage unit 12 isequipped with a stage base 71, which is supported substantiallyhorizontally by a plurality of (e.g. three) second vibration isolationmechanisms (omitted in drawings) placed on base plate BS, wafer stageWST placed above the upper surface of stage base 71, a tube carrier TCarranged on the +Y side of the wafer stage, a stage drive section thatdrives parts such as wafer stage WST and tube carrier TC, and the like.The stage drive is configured including a plurality of motors, whichinclude a pair of Y-axis linear motors LY₁ and LY₂ shown in FIG. 2,however, in FIG. 1, the drive section is shown simply as a block asstage drive section 27, for the sake of simplicity in the drawings.

Details on wafer stage unit 12 will now be described, referring to FIGS.2 to 7.

Stage base 71 is also called a platform, and is made of a flat platethat has a rectangular shape in a planar view (when viewed from above).Stage base 71 is placed in an area between protruded sections BSa andBSb, which are arranged in the vicinity of both edges of base plate BSin the X-axis direction extending in the Y-axis direction. The degree offlatness of the upper surface of stage base 71 is extremely high, andthe upper surface serves as a movement surface when wafer stage WSTmoves.

As it can be seen from FIG. 3A, which is a perspective view of waferstage WST that has been taken out, wafer stage WST is equipped with arectangular solid shaped wafer stage main body 28, and a wafer table WTBfixed on the upper surface of wafer stage main body 28 by vacuumsuction.

In wafer stage main body 28, three openings 28 a, 28 b, and 28 c thathave a rectangular sectional shape are formed penetrating wafer stagemain body 28 from the edge on the +X side to the edge on the −X side.

On the inner side of opening 28 a on the vertical opposing surfaces, apair of permanent magnets 22A and 22B, serving as a Y-axis mover, isrespectively fixed.

On the inner side of openings 28 b and 28 c on the lateral opposingsurfaces, magnetic pole units (a permanent magnet group) 23A to 23D,serving as X-axis movers, are respectively fixed.

Furthermore, in the vicinity of the four corners of the bottom surfaceof wafer stage main body 28, magnetic pole units (permanent magnets) 29Ato 29D (however, magnetic pole unit 29D in the depth of the page surfaceis not shown) that have a triangular sectional shape are arranged.Details regarding magnetic pole units 29A to 28D will be given further,later in the description.

As is shown in the perspective views of FIGS. 2 and 3B, wafer stage mainbody 28 is in a state engaged with a plurality of stators (armaturecoils) extending in the X-axis direction.

More specifically, as the plurality of stators (armature coils), as isshown in FIGS. 3B and 4 (a planar view that shows a wafer stage unit), aY-axis stator 187, X-axis stators 61A, 61B, and 161, and Z-axis stators89A and 89B are arranged. The edge surface on the −X side of these sixstators are each fixed to a plate shaped slider 46 which is placedsubstantially parallel to a YZ plane, and the edge surface on the +Xside of these six stators are each fixed to a plate shaped slider 44which is placed substantially parallel to the YZ plane (refer to FIGS. 2and 4). That is, sliders 44 and 46 and the six stators above constitutea stator unit MY.

In the embodiment, Y-axis stator 187 and the pair of permanent magnets22A and 22B constitute a moving magnet type Y-axis voice coil motor VYthat finely drives wafer stage WST in the Y-axis direction with respectto stator unit MY (refer to FIGS. 5, 8 and the double pointing arrow(two-way arrow) a₁ in FIG. 6, which models the force generated withinwafer stage unit 12).

Further, stator 61A and the pair of magnetic pole units 23A and 23Bconstitute a moving magnet type X-axis linear motor LX₁ that driveswafer stage WST in the X-axis direction with respect to stator unit MY,and stator 61B and the pair of magnetic pole units 23C and 23Dconstitute a moving magnet type X-axis linear motor LX₂ (refer to FIGS.5 and 8).

In this case, by making the Lorentz force generated in X-axis linearmotors LX₁ and LX₂ the same, wafer WST is driven in the X-axis directionby X-axis linear motors LX₁ and LX₂, and also by making the Lorentzforce generated in X-axis linear motors LX₁ and LX₂ differ slightly,wafer stage WST is driven in the rotational direction around the Z-axis(the Oz direction) by X-axis linear motors LX₁ and LX₂ (refer to thedouble pointing arrow a₂ in FIG. 6).

Furthermore, as is shown in FIG. 5, magnetic pole units 29A and 29B andmagnetic pole units 29C and 29D that are fixed to the bottom surface ofwafer stage main body 28 are respectively in an engaged state withZ-axis stators 89A and 89B. Z-axis stators 89A and 89B each resemble theletter T turned upside down in the YZ section, and inside Z-axis stators89A and 89B, armature coils (not shown) are arranged.

Magnetic pole unit 29A and Z-axis stator 89B constitute a Z-axis voicecoil motor VZ₁ (refer to FIGS. 5 and 8) that gives a drive force towafer stage WST in the Z-axis direction, and similarly, magnetic poleunit 29B and Z-axis stator 89B constitute a Z-axis voice coil motor VZ₂(refer to FIG. 8) that gives a drive force to wafer stage WST in theZ-axis direction.

Similarly, magnetic pole unit 29C and Z-axis stator 89A constitute aZ-axis voice coil motor VZ₃ (refer to FIGS. 5 and 8) that gives a driveforce to wafer stage WST in the Z-axis direction, and similarly,magnetic pole unit 29D and Z-axis stator 89A constitute a Z-axis voicecoil motor VZ₄ (refer to FIG. 8) that gives a drive force to wafer stageWST in the Z-axis direction.

That is, by appropriately controlling Z-axis voice coil motors VZ₁ toVZ₄, wafer stage WST can be driven in the Z, θx, and θy directions withrespect to stator unit MY (refer to the double pointing arrow b in FIG.6).

The self-weight of wafer stage WST is supported in a non-contact manneron a movement surface 71 a of stage base 71 (refer to the doublepointing arrow c in FIG. 6) by a supporting force of a self-weightcanceller 101 arranged on the bottom surface of wafer stage WST, as isshown in FIG. 5. As self-weight canceller 101, as an example, a unitthat has a cylinder fixed facing downward on the bottom surface of waferstage main body 28 and a piston inserted into the cylinder from below,and is structured having a static gas bearing (a thrust bearing)arranged on the bottom surface of the piston communicating with apositive pressure space formed inside the cylinder between the cylinderand the upper end surface of the piston can be used. In this case, aradial bearing composed of a static gas bearing is preferably arrangedbetween the outer circumferential surface of the piston and the innercircumferential surface of the cylinder. As self-weight canceller 101,for example, a bellows type self-weight canceller can be used.

As is shown in FIGS. 3B and 5, stator 161 engages with tube carrier TC,which has a rectangular frame shape when viewed from the +X (or −X)side. On the inner surface inside an opening section TCa of tube carrierTC on the +X side and the −X side, magnetic pole units 123A and 123Bsimilar to magnetic pole units 23A and 23B described earlier are fixed.In the embodiment, stator 161 and the pair of magnetic pole units 123Aand 123B constitute a moving magnet type X-axis linear motor RX (referto FIGS. 5 and 8) that drives tube carrier TC in the X-axis directionwith respect to stator unit MY. As moving magnet type X-axis linearmotor RX described above, a moving coil type linear motor can also beemployed.

As is shown in FIGS. 3B and 5, one end of a gas supply pipe 203 and adischarge pipe 204 connects to tube carrier TC, via connector CN,respectively.

Between tube carrier TC and wafer stage WST (wafer stage main body 28),a power usage supply unit 155 is arranged which connects tube carrier TCto wafer stage WST. The configuration of power usage supply unit 155will be described later, along with the configuration of a supply systemof pressurized gas and a supply system of vacuum power usage (vacuumdischarge system) to wafer stage WST.

On each of the bottom surfaces of sliders 44 and 46, plate shape members188A and 188B are arranged as is shown in FIG. 4. On the bottom surfaceof plate shape members 188A and 188B, a plurality of air bearings (notshown) are arranged along the Y-axis direction. And via the plurality ofair bearings, sliders 44 and 46 are supported by levitation in anon-contact manner with respect to movement surface 71 a of stage base71 via a clearance of around several μm. Further, because the pluralityof air bearings is disposed along the Y-axis direction, by making thelevitation force of each air bearing differ, a force in the rotationaldirection around the X-axis (the θx direction) can be made to act onsliders 44 and 46, and further, by making the levitation force ofsliders 44 and 46 different, the whole stator unit MY can be finelydriven in a rotational direction around the Y-axis (the θy direction)(refer to the double pointing arrow g in FIG. 6).

As it can be seen when viewing FIGS. 4 and 2 together, Y-axis linearmotors LY₁ and LY₂ are composed of Y-axis movers 48A and 48B consistingof armature units and Y-axis stators 86 and 87 consisting of magneticpole units.

As it can be seen from FIG. 7 which models the structure inside Y-axislinear motor LY₁, one of the Y-axis movers, 48A, has a plate shapedhousing 196 shown by a dashed-two dotted line in the drawing, aplurality of first armature coils 190 that have a narrow rectangularshape extending in the X-axis direction placed at a predeterminedspacing along the Y-axis direction within housing 196, and a secondarmature coil 195 that has a narrow rectangular shape extending in theY-axis direction placed on the +X side of the plurality of firstarmature coils 190. The other Y-axis mover, 48B, is configured similarto Y-axis mover 48A although it is symmetric to Y-axis mover 48A withrespect to the Y-axis. As is shown in FIG. 2, these Y-axis movers 48Aand 48B are inserted into the inner space of Y-axis stators 86 and 87,respectively.

As is shown in FIG. 2, Y-axis stators 86 and 87 are each equipped with astator 88A and permanent magnets 90 and 95, and are supported bylevitation with respect to the upper surface of protruded sections BSaand BSb via a predetermined clearance by static gas bearings (not shown)such as, for example, air bearings, arranged on the lower surface ofY-axis stators 86 and 87. Further, the movement of Y-axis stators 86 and87 in the X-axis direction and in the θx, θy, and θz directions withrespect to protruded sections BSa and BSb is limited (refer to thedouble pointing arrow f in FIG. 6) by the static gas bearings (notshown) such as, for example, the air bearings. Further, although it isomitted in FIG. 2, Y-axis trim motors 92A and 92B are arranged thatdrive Y-axis stators 86 and 87 in the Y-axis direction, respectively(refer to FIG. 8 and to the double pointing arrow c in FIG. 6).

The other Y-axis stator, 87, is configured similar to Y-axis stator 86although it is symmetric to Y-axis stator 86 with respect to the Y-axis.

Because Y-axis linear motors LY₁ and LY₂ are configured in the mannerdescribed above, by supplying current to each of the first armaturecoils 190, Lorentz forces that drive Y-axis movers 48A and 48B in theY-axis direction are generated due to the electromagnetic interactionbetween the current and the alternating field described above. Further,by supplying current to the second armature coil 195, Lorentz forcesthat drive Y-axis movers 48A and 48B in the X-axis direction aregenerated due to the electromagnetic interaction between the current andthe magnetic field described above formed by the second permanent magnetgroup 95. Accordingly, in the embodiment, by Y-axis linear motors LY₁and LY₂, stator unit MY can be driven in the Y-axis direction as well asbe driven finely in the X-axis direction, and also by making the driveforce in the Y-axis direction generated in Y-axis linear motors LY₁ andLY₂ slightly different, stator unit MY (or as a consequence, wafer stageWST) can be driven in a rotational direction around the Z-axis (the θzdirection) (refer to the double pointing arrow d in FIG. 6).

As is obvious from the description above, in the first embodiment,Y-axis voice coil motor VY, X-axis linear motors LX₁ and LX₂, Y-axislinear motors LY₁ and LY₂, Z-axis voice coil motors VZ₁ to VZ₄, andY-trim motors 92A and 92B make up a wafer stage drive section 27 thatdrives wafer stage WST (refer to FIG. 8). Bearings such as the motors,the air bearings and the like that configure wafer stage unit 12including wafer stage drive section 27 operate under the control of maincontroller 20 (refer to FIG. 8).

Referring back to FIG. 1, positional information on wafer stage WSTwithin the XY plane is detected at all times by a wafer laserinterferometer (hereinafter referred to as ‘wafer interferometer’) 18via a movable mirror 17 fixed on the upper section of wafer stage WST(or to be more precise, the upper surface of wafer table WTB), at aresolution, for example, around 0.5 to 1 nm. Wafer interferometer 18 isfixed to barrel platform 38 in a suspended state, and measures thepositional information of the reflection surface of movable mirror 17whose reference is a reflection surface of a fixed mirror 57 fixed tothe side surface of barrel 40 that makes up projection unit PU, as thepositional information of wafer stage WST.

On wafer table WTB, as is shown in FIG. 3A, a Y movable mirror 17Y thathas a reflection surface orthogonal to the scanning direction, which isthe Y-axis direction, and an X movable mirror 17X that has a reflectionsurface orthogonal to the non-scanning direction, which is the X-axisdirection, are actually provided, and corresponding to these movablemirrors, laser interferometers and fixed mirrors are also arranged forposition measurement in the X-axis direction and position measurement inthe Y-axis direction; however, such details are representatively shownas movable mirror 17, wafer interferometer 18, and fixed mirror 57 inFIG. 1. And, for example, the edge surface of wafer table WTB can bemirror polished so as to form a reflection surface (corresponding to thereflection surfaces of movable mirrors 17X and 17Y). Further, the laserinterferometer for position measurement in the X-axis direction and thelaser interferometer for position measurement in the Y-axis directionare both multi-axis interferometers that have a plurality of measurementaxes, and with these interferometers, other than the X and Y positionsof wafer table WTB, rotation (yawing (rotation in the θz direction),pitching (rotation in the θx direction), and rolling (rotation in the θydirection) can also be measured. Accordingly, in the description below,wafer interferometer 18 is to measure the position of wafer table WTB indirections of five degrees of freedom, in the X, Y, θz, θy, and θxdirections.

Positional information (or velocity information) on wafer stage WST issent to main controller 20, and based on the positional information (orvelocity information) on wafer stage WST, main controller 20 controlsthe position of wafer stage WST within the XY plane via wafer stagedrive section 27.

Next, a configuration of the supply system of pressurized gas to waferstage WST, the vacuum system, power usage supply unit 155 and the likewill be described in detail, referring to FIG. 5 and to FIGS. 9 to 12B.

As is shown in FIG. 5, the +Y end of power usage supply unit 155 isfixed to the surface of tube carrier TC on the −Y side, and the −Y endis fixed to the surface of wafer stage main body 28 on the +Y side.

Inside tube carrier TC, a gas supply pipe line and a discharge pipe lineare formed (not shown). One end of both the gas supply pipe line and thedischarge pipe line connect to one end of gas supply pipe 203 anddischarge pipe 204, respectively, via connecter CN. The other end ofboth gas supply pipe 203 and discharge pipe 204 connect to a gas supplyunit 201 and a vacuum suction unit 202 (refer to FIG. 8) arrangedoutside of wafer stage unit 12.

The other end of both the gas supply pipe line and the discharge pipeline connect to one end of a supply pipe 241 b and a vacuum pipe 241 avia a connecter (not shown). The other end of both supply pipe 241 b andvacuum pipe 241 a connect to power usage supply unit 155, respectively.

Power usage supply unit 155 supplies a fluid (pressurized gas) suppliedfrom gas supply unit 201 via gas supply pipe 203, tube carrier TC, andsupply pipe 241 b to wafer stage WST via a supply pipe 270A, and alsosupplies a negative pressure supplied from vacuum suction unit 202 viadischarge pipe 204, tube carrier TC, and vacuum pipe 241 a to waferstage WST via a vacuum pipe 270B.

In the embodiment, tube carrier TC relays the supply of pressurized gasfrom gas supply unit 201 to wafer stage WST, and also relays the supplyof negative pressure generated in vacuum suction unit 202 to wafer stageWST.

As is obvious from the description so far, in the embodiment, tubes suchas the supply pipe and the vacuum pipe connect to tube carrier TC,however, to wafer stage WST, no piping connects from the outside(excluding piping that is integrally fixed to wafer stage WST, such assupply pipe 270A and vacuum pipe 270B). That is, wafer stage WST in theembodiment is a tubeless stage.

FIG. 9 shows a state where power usage supply unit 155 is attached to asurface on the +Y side of wafer stage main body 28 that constituteswafer stage WST. As is shown in FIG. 9, power usage supply unit 155 iscomposed of a combination of a plurality of cylinder solid members and aplurality of rectangular solid shaped members.

More specifically, as is shown in FIG. 10, which is an enlarged view ofpower usage supply unit 155 taken out, and in FIG. 11, which is anexploded perspective view of power usage supply unit 155, power usagesupply unit 155 is equipped with a first unit 251, consisting of a pairof plate shaped fixed members 231A and 231B fixed to the edge surface ofwafer stage main body 28 on the +Y side and an X-axis solid cylindricalmember 232 serving as a first axis section whose longitudinal directionis in the X-axis direction and has fixed members 231A and 231B fixed toboth edge surfaces in the longitudinal direction, and a second unit 252including a hollow cylindrical member 234 attached on the outercircumference of X-axis solid cylindrical member 232, a third unit 253sequentially connected to the second unit 252, and a Z support member239. Therefore, X-axis solid cylindrical member 232 serving as the firstaxis section is also a moving section that moves according to themovement of wafer stage WST in an X direction.

As is shown in FIG. 11, on the surface of X-axis solid cylindricalmember 232 that constitutes the first unit 251, a plurality of surfacethrottle grooves 232 p of a predetermined depth (ex. a depth of around10 μm) is formed along the longitudinal direction (the X-axis direction)at a predetermined spacing. Further, on the edge surface of X-axis solidcylindrical member 232 on the +X side, two circular holes 232 d and 232b are formed that reach the area close to the center in the X-axisdirection. As it is shown in FIG. 12A, which is a YZ sectional view ofpower usage supply unit 155, and FIG. 12B, which is an enlarged view ofX-axis solid cylindrical member 232 and hollow cylindrical member 234 inFIG. 12A, one of the circular holes 232 d is formed at a positionslightly shifted to the +Z side from the center of the cross-sectionalsurface and the other circular hole 232 b is formed at a positionslightly shifted to the −Z side from the center of the cross-sectionalsurface.

Further, as is shown in FIG. 11, on the upper surface of X-axis solidcylindrical member 232 at the center in the X-axis direction, a circularhole 232 c is formed. As is shown in FIG. 12B, circular hole 232 ccommunicates with circular hole 232 d. Circular hole 232 d and circularhole 232 c form a pipe line that resembles the shape of the letter L,and this pipe line is a first fluid supply pipe line.

Further, as is shown in FIG. 12B, on the lower surface of X-axis solidcylindrical member 232 at the center in the X-axis direction, a circularhole 232 a that communicates with circular hole 232 b is formed.Circular hole 232 b and circular hole 232 a form a pipe line thatresembles the shape of the letter L, and this pipe line is a firstvacuum pipe line. In FIG. 11, surface throttle grooves 232 p werearranged in the circular hole 232 c section, however, as it is obviousfrom FIG. 12, on the opposite side of circular hole 232 c, circular hole232 b that is the first vacuum pipe line is formed. Therefore, it ispreferable to arrange surface throttle grooves 232 p avoiding circularhole 232 b (and circular hole 232 c) and the vicinity of the holes.

As is shown in FIG. 11, in one of the fixed members 231A, flow passages231Aa and 231Ab are formed penetrating fixed member 231A, each made of acircular hole whose longitudinal direction is the X-axis direction sothat the holes communicate with circular hole 232 d and circular hole232 b. As is shown in FIG. 9, flow passage 231Aa connects to one end ofsupply pipe 270A via a connecter (not shown) and flow passage 231Abconnects to one end of vacuum pipe 270B via a connecter (not shown). Theother end of supply pipe 270A and vacuum pipe 270B each connect to apart of wafer stage main body 28. The other fixed member 231B differsfrom fixed member 231A, and is configured of a plate shaped member thatdoes not have any passages formed.

As is shown in FIG. 10, the second unit 252 is configured includinghollow cylindrical member 234, an attachment member 235 fixed on theoutside of hollow cylindrical member 234 at the center in thelongitudinal direction, and a Y-axis solid cylindrical member 236serving as a second axis section that has a part of the tip on one end(the edge surface of on the −Y side) embedded in the edge surface ofattachment member 235 on the +Y side and extends in the Y-axisdirection. Y-axis solid cylindrical member 236 serving as the secondaxis section also serves as a moving section that moves according to themovement of wafer stage WST in the Y-axis direction.

As is shown in FIG. 10, hollow cylindrical member 234 has a diameterslightly larger than the diameter of X-axis solid cylindrical member232, and is in a state where X-axis solid cylindrical member 232 isinserted inside. In this case, as is shown in FIG. 12B, a predeterminedgap is formed entirely between the inner circumferential surface ofhollow cylindrical member 234 and the inner circumferential surface ofX-axis solid cylindrical member 232. Therefore, X-axis solid cylindricalmember 232 is in a state where it can relatively move in the X-axisdirection and the rotational direction around the X-axis with respect tohollow cylindrical member 234. That is, hollow cylindrical member 234configures a first support section that movably supports X-axis solidcylindrical member 232 in the X-axis direction and around the X-axis.

As is shown in FIG. 12B, in hollow cylindrical member 234, on the innercircumferential surface in the X-axis direction, a plurality ofdepressed grooves (e.g. eight) 234 c ₁, 234 c ₂, . . . , 234 c _(n) areformed at a predetermined angular spacing. As is shown in FIG. 12B, oneof the depressed grooves 234 c ₁ is positioned so as to face circularhole 232 c of X-axis solid cylindrical member 232, and in a part of thebottom surface of depressed groove 234 c ₁, a circular hole 234 b thatpenetrates and reaches the outer surface of hollow cylindrical member234 is formed. Further, at a position on the inner surface of hollowcylindrical member 234 facing depressed groove 234 c ₁, depressed groove234 c _(n) is positioned so as to face circular hole 232 a previouslydescribed, and in a part of the bottom surface of depressed groove 234 c_(n), a circular hole 234 a that penetrates and reaches the outersurface of hollow cylindrical member 234 is formed. Depressed grooves234 c ₁, 234 c ₂, . . . , 234 c _(n) can also be arranged not on theinner circumferential surface of hollow cylindrical member 234 but onthe outer periphery surface of X-axis solid cylindrical member 232.Furthermore, these depressed grooves 234 c ₁, 234 c ₂, . . . , 234 c_(n) do not necessarily have to be arranged along the X-axis direction,and a plurality of grooves can be arranged at a predetermined spacing inthe X-axis direction on the outer periphery surface of X-axis solidcylindrical member 232.

As is shown in FIG. 11, attachment member 235 has an outer shape whichis substantially a cube, and a through hole 235 a of a circular shape isformed penetrating the cube from the edge surface on the +X side to theedge surface on the −X side. Inside through hole 235 a, hollowcylindrical member 234 is inserted, and on the outside of hollowcylindrical member 234 at the center in the X-axis direction, attachmentmember 235 is attached in a state where there is no space between themembers.

Inside attachment member 235, pipe lines 235 c and 235 b are formed in astate where one end of each of the pipe lines communicates with circularhole 234 b and circular hole 234 a formed in hollow cylindrical member234, respectively, as is shown in FIG. 12A. In the description below,for the sake of convenience, circular hole 234 b and pipe line 235 cwill be referred to together as a second fluid supply pipe line, andcircular hole 234 a and pipe line 235 b will be referred to together asa second vacuum pipe line.

As is shown in FIG. 12A, on the edge surface of attachment member 235 onthe +Y side, a shallow circular depressed section 235 d is formed, and aY-axis solid cylindrical member 236 orthogonal to X-axis solidcylindrical member 232 is fixed to attachment member 235 in a statewhere the tip section of Y-axis solid cylindrical member 236 on the −Yside is fitted in depressed section 235 d. Y-axis solid cylindricalmember 236 does not necessarily have to be orthogonal to X-axis solidcylindrical member 232 as long as it intersects X-axis solid cylindricalmember 232.

As is shown in FIG. 12A, inside Y-axis solid cylindrical member 236, athird fluid supply pipe line 236 b and a third vacuum pipe line 236 aare formed whose sectional shapes resemble the letter L and have one endthat communicates with the other end of pipe lines 235 c and 235 bformed in attachment member 235 previously described, respectively.Further, on the surface of Y-axis solid cylindrical member 236, aplurality of surface throttle grooves 236 p of a predetermined depth(ex. a depth of around 10 μm) is formed along the longitudinal direction(the Y-axis direction) at a predetermined spacing, as is shown in FIG.11. It is also preferable to arrange the plurality of surface throttlegrooves 236 p formed on the surface of Y-axis solid cylindrical member236, while avoiding the circular hole 236 a (and circular hole 236 b)section on the surface of Y-axis solid cylindrical member 236.

As is shown in FIG. 10, the third unit 253 is configured including a Ysupport member 237 that has a substantially cubic outer shape and isarranged on the outer circumferential side in the vicinity of the edgesection on the +Y side of Y-axis solid cylindrical member 236, and aZ-axis solid cylindrical member 238 serving as a third axis sectionfixed to the lower surface (the surface on the −Z side) of Y supportmember 237 orthogonal to X-axis solid cylindrical member 232 and toY-axis solid cylindrical member 236. Z-axis solid cylindrical member 238serving as the third axis section is also a moving section that movesaccording to the movement of wafer stage WST in a Z direction. Z-axissolid cylindrical member 238 does not necessarily have to be attached toY support member 237 orthogonal to X-axis solid cylindrical member 232and Y-axis solid cylindrical member 236.

In Y support member 237, a circular through hole 237 a that penetrates Ysupport member 237 from the edge surface on the +Y side to the edgesurface on the −Y side is formed (refer to FIG. 11), and Y-axis solidcylindrical member 236 is inserted into through hole 237 a via apredetermined clearance around the entire circumference of Y-axis solidcylindrical member 236. Therefore, Y-axis solid cylindrical member 236is in a relatively movable state in the Y-axis direction and therotational direction around the Y-axis with respect to Y support member237. That is, Y support member 237 constitutes a second support sectionthat movably supports Y-axis solid cylindrical member 236 in the Y-axisdirection and around the Y-axis.

As is shown in FIG. 12A, on the inner circumferential surface of Ysupport member 237, a plurality of depressed grooves 237 b _(j) (j=1 ton, for example, n is 8,) that extend in the Y-axis direction is formedat a predetermined angular spacing as in depressed grooves 234 c ₁, 234c ₂, . . . , 234 c _(n) of hollow cylindrical member 234 describedearlier (however, in FIG. 12A, only two depressed grooves 237 b ₁ and237 b _(n) are shown, refer to FIG. 11). And, in Y support member 237, afourth vacuum pipe line 237 c is formed, in a state where the pipe linecommunicates with depressed groove 237 b _(n) located at a positionclosest to the −Z side. Further, in Y support member 237, a fluid supplypipe line 237 d ₂ is formed, in a state where the pipe line communicateswith depressed groove 237 b ₁ located at a position closest to the +Zside. Fluid supply pipe line 237 d ₂ communicates with a fluid supplypipe line 237 d ₁ formed on the lower half section of support member 237via a fluid supply pipe line 237 d ₃. In this case, fluid supply pipeline 237 d ₃ is a half arc shaped pipe line formed inside Y supportmember 237 in half of the depth of the page surface of FIG. 12A. In thedescription below, fluid supply pipe lines 237 d ₁, 237 d ₂, and 237 d₃will be referred to together as “a fourth liquid fluid supply pipe line237 d”. The plurality of depressed grooves 237 b _(j) can be formed notonly on the inner circumferential surface of Y support member 237 butalso on the outer circumference of Y-axis solid cylindrical member 236,and the grooves do not necessarily have to be arranged along the Y-axisdirection.

As is shown in FIG. 11, in Z-axis solid cylindrical member 238, surfacethrottle grooves 238 p of a predetermined depth (ex. a depth of around10 μm) is formed in the center along the longitudinal direction (theZ-axis direction) at a predetermined spacing. Further, Z-axis solidcylindrical member 238 is fixed in a state where the upper end is fittedinside a shallow circular depressed section 237e formed in the lower endsurface of Y support member 237. As is shown in FIG. 12A, inside Z-axissolid cylindrical member 238, a fifth vacuum pipe line 238 a in theZ-axis direction is formed in a penetrated state, in a statecommunicating with the fourth vacuum pipe line 237 c formed in Y supportmember 237 previously described. Further, inside Z-axis solidcylindrical member 238, on the −Y side of the fifth vacuum pipe line 238a, a fifth fluid supply pipe line 238 b in the Z-axis direction isformed, in a state communicating with the fourth fluid supply pipe line237 d. The end of the fifth vacuum pipe line 238 a on the −Z sideconnects to one end of vacuum pipe 241 a described earlier via aconnecter (not shown), and the end of the fifth fluid supply pipe line238 b connects to one end of supply pipe 241 b described earlier via aconnecter (not shown).

In Z-axis solid cylindrical member 238, a branched pipe line 238 c isformed that branches from the fifth vacuum pipe line 238 a from thecenter in the Z-axis direction toward the +Y direction, and the tip ofbranched pipe line 238 c opens toward the outside of the outercircumferential surface of Z-axis solid cylindrical member 238 (refer toFIG. 11). In Z-axis solid cylindrical member 238, a branched pipe line238 d is formed that branches from the fifth fluid supply pipe line 238b from the center in the Z-axis direction toward the −Y direction, andthe tip of branched pipe line 238 d opens toward the outside of theouter circumferential surface of Z-axis solid cylindrical member 238. Itis preferable to form surface throttle grooves 238 p formed on thesurface of Z-axis solid cylindrical member 238, while avoiding branchedpipe line 238 c and its neighboring area.

As is shown in FIGS. 10, 12 and the like, Z support member 239 has anouter shape which is a rough rectangular solid shape, and an edgesurface 239 c of Z support member 239 on the +Y side is fixed to theedge surface of tube carrier TC on the −Y side (refer to FIG. 12A).

In Z support member 239, a circular through hole 239 a is formed fromthe edge surface on the +Z side to the edge surface on the −Z side(refer to FIG. 11), and Z-axis solid cylindrical member 238 is insertedinto through hole 239 a via a predetermined clearance around the entirecircumference of Z-axis solid cylindrical member 238. Therefore, Z-axissolid cylindrical member 238 is in a relatively movable state in theZ-axis direction and the rotational direction around the Z-axis withrespect to Z support member 239. That is, Z support member 239constitutes a third support section that movably supports Z-axis solidcylindrical member 238 in the Z-axis direction and around the Z-axis.

As is shown in FIG. 12A, on the inner circumferential surface of Zsupport member 239, a plurality of depressed grooves 239 b _(i) (i=1 ton, for example, n is 8,) that extend in the Z-axis direction is formedat a predetermined angular spacing as in depressed grooves 234 c ₁, 234c ₂, . . . , 234 c _(n) of hollow cylindrical member 234 describedearlier (however, in FIG. 12A, only two depressed grooves 239 b ₁ and239 b _(n) are shown, refer to FIG. 11). The plurality of depressedgrooves 239 b _(j) can be formed not only on the inner circumferentialsurface of Z support member 239 but also on the outer circumference ofZ-axis solid cylindrical member 238, and the grooves do not necessarilyhave to be arranged along the Z-axis direction.

Further, as the material for X-axis solid cylindrical member 232, hollowcylindrical member 234, Y-axis solid cylindrical member 236, and Z-axissolid cylindrical member 238, ceramic or aluminum can be used.

Next, the operation of power usage supply unit 155 configured in themanner described above will be briefly described.

As is described earlier, the fluid (pressurized gas) supplied to tubecarrier TC from gas supply unit 201 via gas supply pipe 203 is suppliedto the fifth fluid supply pipe line 238 b within Z-axis solidcylindrical member 238 of power usage supply unit 155. Next, a part ofthe pressurized gas supplied inside the fifth fluid supply pipe line 238b is discharged outside the outer circumferential surface of Z-axissolid cylindrical member 238 via branched pipe line 238 d, and most ofthe remaining gas passes through the fifth fluid supply pipe line 238 band then moves toward the fourth fluid supply pipe line 237 d formed inY support member 237.

The pressurized gas discharged outside the outer circumferential surfaceof Z-axis solid cylindrical member 238 spreads swiftly entirely in theZ-axis direction in the gap between Z-axis solid cylindrical member 238and Z support member 239 via grooves 239 b ₁ to 239 b _(n) formed on theinner circumferential surface of Z support member 239, and also enterssurface throttle grooves 238 p on the outer circumferential surface ofZ-axis solid cylindrical member 238 and spreads in the entirecircumferential direction in the gap between Z-axis solid cylindricalmember 238 and Z support member 239. Accordingly, due to the staticpressure of the pressurized gas (or the pressure within the gap) thathas entered surface throttle grooves 238 p, Z-axis solid cylindricalmember 238 is supported in a non-contact manner with respect to Zsupport member 239. That is, in the manner described above, a type ofstatic gas bearing is configured in the entire area of surface throttlegrooves 238 p. In this case, because surface throttle grooves 238 p ofZ-axis solid cylindrical member 238 is formed on the entirecircumference of the outer surface of Z-axis solid cylindrical member238, the static pressure of the pressurized gas is substantially equalalong the entire circumference, therefore the same clearance is made inthe entire circumferential direction of Z-axis solid cylindrical member238. As a consequence, Z-axis solid cylindrical member 238 is in a statewhere movement in the Z-axis direction and the rotational directionaround the Z-axis of Z-axis solid cylindrical member 238 with respect toZ support member 239 is permissible.

Meanwhile, the pressurized air that moves toward the fourth fluid supplypipe line 237 d sequentially passes through fluid supply pipe lines 237d ₁, 237 d ₃, and 237 d ₂ and then a part of the pressurized gas isdischarged from an opening end of fluid supply pipe line 237 d ₂ formedin the bottom surface inside depressed groove 237 b ₁ into a slight gapin between Y-axis solid cylindrical member 236 and Y support member 237,and most of the remaining gas moves toward the second fluid supply pipeline (235 c and 234 b) formed inside attachment member 235 via the thirdfluid supply pipe line 236 b formed within Y-axis solid cylindricalmember 236.

The pressurized gas discharged into the slight gap in between Y-axissolid cylindrical member 236 and Y support member 237 swiftly spreads inthe entire Y-axis direction in the gap between Y-axis solid cylindricalmember 236 and Y support member 237 via each of the grooves 237 b ₁ to237 b _(n) formed in the inner circumferential surface of Y supportmember 237, and also enters surface throttle grooves 236 p on the outercircumferential surface of Y-axis solid cylindrical member 236 andspreads in the entire circumferential direction in the gap betweenY-axis solid cylindrical member 236 and Y support member 237.Accordingly, due to the static pressure of the pressurized gas (or thepressure within the gap) that has entered surface throttle grooves 236p, Y-axis solid cylindrical member 236 is supported in a non-contactmanner with respect to Y support member 237. That is, in the mannerdescribed above, a type of static gas bearing is configured in theentire area of surface throttle grooves 236 p. In this case, becausesurface throttle grooves 236 p of Y-axis solid cylindrical member 236 isformed on the entire circumference of the outer surface of Y-axis solidcylindrical member 236, the static pressure of the pressurized gas issubstantially equal along the entire circumference, therefore the sameclearance is made in the entire circumferential direction of Y-axissolid cylindrical member 236. As a consequence, Y-axis solid cylindricalmember 236 is in a state where movement in the Y-axis direction and therotational direction around the Y-axis of Y-axis solid cylindricalmember 236 with respect to Y support member 237 is permissible.

Meanwhile, of the second fluid supply pipe line (235 c and 234 b), thepressurized air supplied to the second fluid supply pipe line ispartially discharged from circular hole 234 b formed in hollowcylindrical member 234 into a slight gap in between hollow cylindricalmember 234 and X-axis solid cylindrical member 232 via depressed groove234 c ₁, and the remaining gas is supplied to the first fluid supplypipe line (232 c and 232 d) formed in X-axis solid cylindrical member232.

The pressurized gas discharged into the slight gap in between hollowcylindrical member 234 and X-axis solid cylindrical member 232 swiftlyspreads in the entire X-axis direction in the gap between hollowcylindrical member 234 and X-axis solid cylindrical member 232 via eachof the grooves 234 c ₁ to 234 c _(n) formed in the inner circumferentialsurface of hollow cylindrical member 234, and also enters surfacethrottle grooves 232 p on the outer circumferential surface of X-axissolid cylindrical member 232 and spreads in the entire circumferentialdirection in the gap between X-axis solid cylindrical member 232 andhollow cylindrical member 234. Accordingly, due to the static pressureof the pressurized gas (or the pressure within the gap) that has enteredsurface throttle grooves 232 p, X-axis solid cylindrical member 232 issupported in a non-contact manner with respect to hollow cylindricalmember 234. That is, in the manner described above, a type of static gasbearing is configured in the entire area of surface throttle grooves 232p. In this case, because surface throttle grooves 232 p of X-axis solidcylindrical member 232 is formed on the entire circumference of theouter surface of X-axis solid cylindrical member 232, the staticpressure of the pressurized gas is substantially equal along the entirecircumference, therefore the same clearance is made in the entirecircumferential direction of X-axis solid cylindrical member 232. As aconsequence, X-axis solid cylindrical member 232 is in a state wheremovement in the X-axis direction and the rotational direction around theX-axis of X-axis solid cylindrical member 232 with respect to hollowcylindrical member 234 is permissible.

Meanwhile, the pressurized gas supplied to the first fluid supply pipeline (232 c and 232 d) is sent inside wafer stage main body 28sequentially passing through the first fluid supply pipe line, flowpassage 231Aa formed in fixed member 231A (refer to FIG. 11), and supplypipe 270A (refer to FIG. 9). The pressurized gas sent inside wafer stagemain body 28 passes through a gas supply pipe line (not shown) insidewafer stage main body 28 and is supplied and used in various mechanismsof wafer stage WST. In the embodiment, for example, the pressurized gassent inside wafer stage main body 28 is supplied to self-weightcanceller 101 described earlier, and as well as to an elevatingmechanism (not shown) that elevates vertical movement pins (center-ups)(not shown) arranged on wafer holder 25 for elevating wafer W.

Meanwhile, when vacuum suction by vacuum suction unit 202 begins, thenegative pressure generated in vacuum suction unit 202 is supplied to avacuum pipe line inside wafer stage main body 28 via discharge pipe 204,tube carrier TC, vacuum pipe 241 a, power usage supply unit 155, andvacuum pipe 270B.

During the suction operation, a gas flow that flows toward the secondvacuum pipe line (234 a and 235 b) sequentially from the wafer stagemain body 28 side via vacuum pipe 270B, flow passage 231Ab formed infixed member 231A, the first vacuum pipe line (232 b and 232 a) formedinside X-axis axis solid cylindrical member 232, and depressed groove234 c _(n) formed in hollow cylindrical member 234 is generated. By thenegative pressure caused by the gas flow, the pressurized gas suppliedto the gap between X-axis axis solid cylindrical member 232 and hollowcylindrical member 234 is suctioned, and by the suction force, thepressurized air swiftly spreads to the entire circumference of X-axissolid cylindrical member 232 and a constant amount of pressurized gas isalso maintained within the gap.

Further, inside Y-axis solid cylindrical member 236 and Y support member237, a gas flow that flows toward the fourth vacuum pipe line 237 c fromthe third vacuum pipe line 236 a formed in Y-axis solid cylindricalmember 236 via depressed groove 237 b _(n) formed in Y support member237 is generated. By the negative pressure caused by the gas flow, thepressurized gas supplied to the gap between Y-axis axis solidcylindrical member 236 and Y support member 237 is suctioned, and thepressurized air swiftly spreads to the entire circumference of Y-axissolid cylindrical member 236 and a constant amount of pressurized gas isalso maintained within the gap.

Further, inside the fifth vacuum pipe line 238 a formed in Z-axis solidcylindrical member 238, a gas flow that flows toward vacuum pipe 241 ais generated. By the negative pressure caused by the gas flow, thepressurized gas supplied to the gap between Z-axis axis solidcylindrical member 238 and Z support member 239 is suctioned viabranched pipe line 238 c, and the pressurized air swiftly spreads to theentire circumference of Z-axis solid cylindrical member 238 and aconstant amount of pressurized gas is also maintained within the gap.

Further, inside vacuum pipe 241 a, tube carrier TC, and discharge pipe204 a gas flow that flows toward vacuum suction unit 202 is generated.

In the embodiment, by the gas flow described above due to the negativepressure generated in vacuum suction unit 202, operations such as forexample, vacuum suction of wafer W by wafer holder 25, vacuum suction ofwafer table WTB by wafer stage main body 28, vacuum suction of the waferby the tip of the vertical movement pins (center-ups) and the like areperformed inside wafer stage WST.

Further, as is stated in the pamphlet of International PublicationWO2004/053953, in an immersion exposure apparatus that projects apattern on a wafer in a state where a liquid (e.g. pure water) issupplied in the space between projection optical system PL and wafer W,when there is a risk of the liquid moving to the back surface of wafer Wit is disclosed that the liquid is to be suctioned. Therefore, forexample, a new suction pipe can be arranged in addition to dischargepipe 270B, and the liquid that may move to the back surface of waferholder 25 can be suctioned using the vacuum. In addition, the sectionwith the risk of the liquid moving to the back surface of wafer stageWST can be appropriately suctioned using power usage supply unit 155. Inthe case disturbance such as vibration occurs due to the suction of theliquid that may affect the exposure accuracy, the suction of the liquidcan be performed when exposure operation is not being performed (e.g.during wafer exchange after the completions of the exposure operation).As long as the national laws in designated states (or elected states),on which this international application is applied, permit, thedisclosure of the U.S. Patent Application corresponding to the pamphletof International Publication WO2004/053953 is incorporated herein byreference.

Power usage supply unit 155 can supply the liquid whose temperature hasbeen adjusted to wafer stage WST. To be more specific, a supply pipeindependent from supply pipe 270A can be arranged and the liquid whosetemperature has been adjusted can be supplied to permanent magnets 22A,22B, 23A to 23D, and 29A to 29D arranged in wafer stage main body 28.Accordingly, heat generation of permanent magnets 22A, 22B, 23A to 23D,and 29A to 29D due to eddy current can be reduced. Further, by supplyingthe liquid whose temperature has been adjusted to wafer holder 25, thetemperature of wafer holder 25 can be adjusted.

In case the number of supply pipes and discharge pipes increases, aplurality of power usage supply unit 155 can be arranged. For example,in the case two power usage supply units 155 are arranged, the units canbe arranged horizontally symmetrical or vertically symmetrical.

During the exposure operation, main controller 20 drives tube carrier TCvia X-axis linear motor RX in the same direction as the steppingdirection of wafer stage WST and makes tube carrier TC roughly followwafer stage WST. In this operation, main controller 20 makes X-axislinear motor RX act a drive force that makes tube carrier TC move at aconstant speed. In the embodiment, even if tube carrier TC does notfollow wafer stage WST in the X, Y directions with good precision,hollow cylindrical member 234 movably supports X-axis axis solidcylindrical member 232 while Y support member 237 movably supportsY-axis axis solid cylindrical member 236. Therefore, no force is appliedto wafer stage WST from power usage supply unit 155. Similarly, in thecase wafer stage WST is driven in the Z direction, because Z supportmember 239 movably supports Z-axis axis solid cylindrical member 238, noforce (e.g. tension) is applied to wafer stage WST from power usagesupply unit 155.

As is described in detail above, according to wafer stage unit 12 in theembodiment, power usage supply unit 155 that connects to wafer stageWST, which moves on upper surface 71 a of stage base 71, and suppliespressurized gas (fluid) or vacuum to wafer stage WST is configuredincluding X-axis axis solid cylindrical member 232 (the first axissection), hollow cylindrical member 234 (the first support section),Y-axis axis solid cylindrical member 236 (the second axis section), Ysupport member 237 (the second support section), Z-axis axis solidcylindrical member 238 (the third axis section), and Z support member239 (the third support section), and X-axis axis solid cylindricalmember 232 is movably supported in the X-axis direction and around theX-axis by hollow cylindrical member 234, Y-axis axis solid cylindricalmember 236 is movably supported in the Y-axis direction and around theY-axis by Y support member 237, and Z-axis axis solid cylindrical member238 is movably supported in the Z-axis direction and around the Z-axisby Z support member 239. Accordingly, even if a force in any directionof six degrees of freedom acts on power usage supply unit 155 due to themovement of wafer stage WST, because power usage supply unit 155 absorbsthe force by changing its position and attitude according to the force,power usage supply unit 155 does not interfere with the movement of thestage. Accordingly, there is no decrease in position controllabilitycaused by dragging a tube as in the case when tubes are used for thepiping when supplying the fluid and the position controllability ofwafer stage WST can be favorably secured.

Further, because a first, second, and third static gas bearings arearranged between X-axis axis solid cylindrical member 232 and hollowcylindrical member 234, Y-axis axis solid cylindrical member 236 and Ysupport member 237, and Z-axis axis solid cylindrical member 238 and Zsupport member 239, respectively, the space between X-axis axis solidcylindrical member 232 and hollow cylindrical member 234, Y-axis axissolid cylindrical member 236 and Y support member 237, and Z-axis axissolid cylindrical member 238 and Z support member 239 can each beconfigured in a non-contact manner, which allows power usage supply unit155 to change its position and attitude without generating a resistingforce even if a force in any direction of six degrees of freedom acts onpower usage supply unit 155 due to the movement of wafer stage WST.Accordingly, decrease in position controllability due to power usagesupply unit 155 can be almost completely prevented.

Further, in the embodiment, because power usage supply unit 155 isarranged in tube carrier TC that moves in a constant speed along theX-axis direction, by making tube carrier roughly follow the movement ofwafer stage WST in the X-axis direction, the permissible range of powerusage supply unit 155 in the X-axis direction can be designed small,which consequently makes it possible to reduce the size of wafer stageunit 12 and also to reduce the amount of heat generated in the linearmotor.

Further, according to exposure apparatus 100 of the embodiment, becausewafer stage unit 12 described above is used as the stage unit for movingwafer W serving as a substrate, position controllability of wafer W(wafer stage WST) when performing exposure operation by thestep-and-scan method in which the pattern of reticle R is transferredonto a plurality of shot areas on wafer W can be improved, and as aconsequence, the pattern of reticle R can be transferred with highprecision on wafer W.

In the embodiment above, the case has been described where tube carrierTC performs a constant speed motion, however, tube carrier TC can alsobe driven by arranging a reflection surface in tube carrier TC,measuring the position of tube carrier TC using an interferometer or anencoder, and making tube carrier TC follow wafer stage WST based on themeasurement results.

In the embodiment described above, Y-axis axis solid cylindrical member236 was attached to Z-axis axis solid cylindrical member 238, however,hollow cylindrical member 234 or X-axis axis solid cylindrical member232 can also be attached to Z-axis axis solid cylindrical member 238.

Further, in the embodiment described above, X-axis axis solidcylindrical member 232 was configured to be a movement section, however,hollow cylindrical member 234 can also be configured to be a movementsection. Similarly, Y-axis axis solid cylindrical member 236 and Z-axisaxis solid cylindrical member 238 were configured to be movementsections, however, the members that surround both Y-axis axis solidcylindrical member 236 and Z-axis axis solid cylindrical member 238 canalso be configured to be movement sections.

A Second Embodiment

A second embodiment of the present invention is described below,referring to FIGS. 13 to 15. For parts that have the same or similararrangement as the first embodiment previously described, the samereference numerals will be used, and the description thereabout will bebrief, or entirely omitted. In the exposure apparatus of the secondembodiment, only a part of the configuration of the wafer stage unit(stage unit) differs, and the configuration of other sections is similarto exposure apparatus 100 of the first embodiment previously described.

FIG. 13 shows a perspective view of a configuration of wafer stage unit12′ related to the second embodiment. When comparing FIGS. 13 and 2, itcan be seen that the section driven in the Y-axis direction by Y-axislinear motors LY₁ and LY₂ of wafer stage unit 12′ in the secondembodiment differs from wafer stage unit 12 in the first embodiment.More specifically, in wafer stage unit 12′, instead of stator unit MYpreviously described, a moving body unit MY′ is arranged, and instead oftube carrier TC attached to stator unit MY, a counter mass 30 in whichwafer stage WST is incorporated is arranged. In the description below,from the viewpoint of avoiding repetition, these differences will bemainly described. The basic configuration of wafer stage unit 12′ in theembodiment is stated in the description of Japanese Patent ApplicationNo. 2004-116043, which is a previous application.

FIG. 14A shows a perspective view of counter mass 30 and wafer stage WSTattached to the counter mass extracted from wafer stage unit 12′, andFIG. 14 shows a sectional view of FIG. 14A in an X-Z plane. Further,FIG. 15 shows a planar view of wafer stage unit 12′ in a state wherewafer table WTB is detached from wafer stage WST.

As is obvious from FIG. 15, counter mass 30 has a rectangular shapedopening formed in the center on the upper surface, and has a shape of abox that has four thick side walls, especially the walls on both sidesin the Y-axis direction. Wafer stage WST that can relatively move withrespect to counter mass 30 is attached to counter mass 30 in a statewhere wafer stage main body 28 is housed inside the space in countermass 30 (refer to FIG. 14B).

In opening 30 a formed in the side wall of counter mass 30 on the +Xside and an opening facing opening 30 a in the side wall on the −Y side,both ends of a Y-axis stator 480 in the longitudinal direction,consisting of an armature unit whose configuration is similar to Y-axisstator 80 previously described, are inserted and fixed. Similar toY-axis stator 80 previously described, Y-axis stator 480 is alsoinserted into the space between the pair of permanent magnets 22A and22B arranged in wafer stage main body 28, and Y-axis stator 480 and thepair of permanent magnets 22A and 22B constitute a linear motor thatfinely drives wafer stage WST along the Y-axis direction.

Further, in openings 30 b and 30 c formed in counter mass 30, both endsof X-axis stators 461A and 461B in the longitudinal direction, eachconsisting of an armature unit whose configuration is similar to X-axisstators 61A and 61B previously described, are inserted and fixed (referto FIG. 14A). Similar to X-axis stators 61A and 61B previouslydescribed, X-axis stators 461A and 461B are also inserted into the spacebetween magnetic pole units 23A and 23B and the space between magneticpole units 23C and 23D arranged in wafer stage main body 28,respectively. That is, X-axis stators 461A and 461B and magnetic poleunits 23A to 23D constitute a pair of linear motors that drives waferstage WST along the X-axis direction.

As is shown in FIG. 14A, inside each of the openings 30d and 30e formedin counter mass 30, X-axis movers 24A and 24B are arranged, eachconsisting of a pair of magnetic pole units (a permanent magnet group)that extend in the X-axis direction. In the inner space of each of theX-axis movers 24A and 24B, X-axis stators (armature coils) 26A and 26Bmade up of armature units extending in the X-axis direction thatconstitute moving body unit MY′ as it will be described later areinserted, respectively. X-axis movers 24A and 24B constitute a linearmotor (a second drive unit) that drives the counter mass along theX-axis direction.

As is shown in FIG. 15, moving body unit MY′ is equipped with X-axisstators 26A and 26B previously described, a first plate shaped member184 placed at a position equally apart from X-axis stators 26A and 26Bin the Y-axis direction under counter mass 30 parallel to the XY planeextending in the X-axis direction, Z-axis stators 89A and 89B placed onboth sides of first plate shaped member 184 in the Y-axis directionwhose longitudinal direction is the X-axis direction, a second plateshaped member 186 placed on the +Y side of X-axis stator 26B whoselongitudinal direction is the X-axis direction, and a slider 44 fixed toone end of X-axis stators 26A and 26B, the first plate shaped member184, Z-axis stators 89A and 89B, and the second plate shaped member 186in the longitudinal direction (the end on the +X side) and a slider 46fixed to the other end of X-axis stators 26A and 26B, the first plateshaped member 184, Z-axis stators 89A and 89B, and the second plateshaped member 186 in the longitudinal direction (the end on the −Xside). By sliders 44 and 46, X-axis stators 26A and 26B, the first plateshaped member 184, Z-axis stators 89A and 89B, and the second plateshaped member 186 are maintained in a predetermined positionalrelationship.

The first plate shaped member 184 has its upper surface (the surface onthe +Z side) processed flatly, and is placed under the bottom surface ofcounter mass 30 as is shown in FIG. 15. Meanwhile, on the bottom surfaceof counter mass 30 in the center in the Y-axis direction, a member 83 isfixed that has a plurality of static gas bearings (not shown) (e.g. airbearings) arranged at a predetermined spacing on its bottom surfacealong the X-axis direction. Counter mass 30 is supported in anon-contact manner with respect to each section of moving body unit MY′by the static pressure of the pressurized gas blowing out to the firstplate shaped member 184 from the plurality of air bearings.

As is shown in FIG. 14B, self-weight canceller 101 is arranged on thebottom surface of wafer stage WST (wafer stage main body 28). As isshown in FIG. 14B, in counter mass 30, the surface that facesself-weight canceller 101 is a movement surface of wafer stage WST.Because counter mass 30 has the movement surface of wafer stage WST,stage base 71 can be made at a low cost.

In the space between counter mass 30 and wafer stage main body 28, powerusage supply unit 155 that has a configuration similar to the unit inthe first embodiment is arranged, as is shown in FIG. 15. Power usagesupply unit 155 is used as a relay mechanism when supplying pressurizedgas supplied from a gas supply unit (not shown) arranged outside thewafer stage unit via gas supply pipe 203 connected to counter mass 30 orsupplying negative pressure generated in a vacuum suction unit (notshown) arranged outside the wafer stage unit via vacuum pipe 204connected to counter mass 30 to wafer stage WST.

Other arrangements of wafer stage unit 12′ is similar to wafer stageunit 12 in the first embodiment previously described. Accordingly,forces similar to the first embodiment act between moving body unit MY′,Y-axis linear motors LY₁ and LY₂, stage base 71, and frame caster FC.

In the exposure apparatus of the second embodiment configured in themanner described above, operations similar to the ones described in thefirst embodiment previously described are performed. However, in thesecond embodiment, because the exposure apparatus is equipped withcounter mass 30, when wafer stage WST is driven in one direction (the +Xdirection (or the −X direction)) in the X-axis direction, counter mass30 receives the reaction force and is driven in the opposite direction(the −X direction (or the +X direction)) of wafer stage WST. Further, inorder to reduce the movement strokes of counter mass 30, main controller20 gives an initial velocity to drive counter mass 30 in the samedirection as wafer stage WST using X-axis movers 24A and 24B and X-axisstators 26A and 26B that constitute the second drive unit.

The vacuum of wafer holder 25 used in wafer stage WST of wafer stageunit 12, the supply of pressurized gas to self-weight canceller 101, andthe supply of pressurized gas used for elevating the center-ups forwafer elevation are performed via counter mass 30 and power usage supplyunit 155 arranged in the space between counter mass 30 and wafer stagemain body 28. In this case, hollow cylindrical member 234 described inthe first embodiment can movably support X-axis solid cylindrical member232 along the X direction, according to the relative movement amountalong the X direction to wafer stage main body 28 and counter mass 30.Similarly, Y support member 237 and Z support member 239 movably supportY-axis solid cylindrical member 236 and Z-axis solid cylindrical member238, respectively, according to the movement of wafer stage main body 28in the Y direction and Z direction.

As is described so far, according to wafer stage unit 12′ related to thesecond embodiment, since the unit is equipped with power usage supplyunit 155 previously described connecting to wafer stage WST that moveson upper surface 71 a of stage base 71, and power usage supply unit 155is arranged in counter mass 30, decrease in position controllability ofthe wafer stage due to power usage supply unit 155 can be almostcompletely prevented as in the first embodiment previously described.Further, in the second embodiment, power usage supply unit 155 suppliesfluid (pressurized gas) to wafer stage WST via counter mass 30 whichmoves in the opposite direction of wafer stage WST by the reaction forcewhen wafer stage WST is driven in the X-axis direction, or morespecifically, power usage supply unit 155 performs the supply of fluidto wafer stage WST relaying counter mass 30 arranged close to waferstage WST, therefore, when the case is compared with when the fluid issupplied to the wafer stage directly from outside the stage unit viapiping such as tubes, the resisting force that accompanies the draggingof a tube can be reduced, which makes it possible to improve theposition controllability of wafer stage WST.

Further, according to the exposure apparatus of the second embodiment,because wafer stage unit 12′ described above is used as the stage unitthat moves wafer W serving as a substrate, position controllability ofwafer W (wafer stage WST) when performing exposure operation by thestep-and-scan method in which the pattern of reticle R is transferredonto a plurality of shot areas on wafer W can be improved, and as aconsequence, the pattern of reticle R can be transferred with highprecision on wafer W.

In the second embodiment above, the case has been described where theso-called “local counter mass” that surrounds wafer stage WST is used ascounter mass 30, however, the present invention is not limited to this,and the configuration does not matter as long as the counter mass movesin the opposite direction of wafer stage WST by the reaction force ofthe drive of wafer stage WST.

A MODIFIED EXAMPLE

A modified example of the power usage supply unit is described below,referring to FIGS. 16 to 22.

FIG. 16 shows a perspective view of a power usage supply unit 155′ ofthe modified example, whereas FIG. 17 shows an exploded perspective viewof power usage supply unit 155′. Further, FIG. 18 shows a perspectiveview of power usage supply unit 155′ sectioned in the XZ surface aroundthe center in the Y-axis direction, and FIG. 19 shows a perspective viewof power usage supply unit 155′ sectioned in the YZ surface around thecenter in the X-axis direction. Further, FIGS. 20 and 21 are views usedfor describing the gas flow inside power usage supply unit 155′. Of thedrawings, FIG. 20 is a sectional view of power usage supply unit 155′sectioned along corresponding to the same XZ surface in FIG. 18, andFIG. 21 is a sectional view of power usage supply unit 155′ sectionedalong corresponding to the same YZ surface in FIG. 19.

Power usage supply unit 155′ is configured by a combination of fourmembers shown in FIG. 17; a first member 103, a second member 105, athird member 107, and a fourth member 111, serving as a first axissection. Power usage supply unit 155′ is incorporated in a stage unitthat has counter mass 30 (refer to FIG. 22) as in the second embodimentpreviously described. FIG. 17 is a view that shows the first to fourthmembers extracted, in a state assembled as power usage supply unit 155′(the state in FIG. 16), and it is a matter of course that the thirdmember 107 and the fourth member 111 are each actually made of aplurality of components so that other members can be incorporated.

As is shown in FIG. 17, the first member 103 consists of a solidcylindrical member whose longitudinal direction is in the X-axisdirection, and on the outer circumferential surface excluding thesection on both ends in the longitudinal direction, a plurality ofsurface throttle grooves 103 b of a predetermined depth (ex. a depth ofaround 10 μm) is formed at a predetermined spacing. On the end sectionof the first member 103 on the +X side, a connecter section 103 a isarranged, and on the end section on the −X side, a connecter section103c similar to connecter section 103 a is arranged (not shown in FIG.17, refer to FIG. 18). To connecter section 103 a, one end of a gassupply pipe (not shown) is connected, and the other end of the gassupply pipe is connected to gas supply unit 201 (refer to FIG. 8)previously described. To connecter section 103 c, one end of a vacuumpipe (not shown) is connected, and the other end of the vacuum pipe isconnected to vacuum suction unit 202 previously described.

As is shown in FIG. 18, inside the first member 103, a gas supply pipeline 211 a that reaches the section slightly to the −X side of thecenter in the X-axis direction from the edge surface of connectersection 103 a and a vacuum pipe line 211c that reaches the sectionslightly to the +X side of the center in the X-axis direction from theedge surface of connecter section 103 c are respectively formed.

The end section of gas supply pipe line 211 a on the +X side is formedso that the diameter is slightly smaller than other sections. In thevicinity of the end section of gas supply pipe line 211 a on the −Xside, seven branched pipe lines 211 b ₁ to 211 b ₇ that reach the outercircumferential surface of the first member 103 are formed in a radialdirection, as is shown in FIGS. 20 and 21. Branched pipe lines 211 b ₁to 211 b ₇ are each formed so that the diameter on the outercircumferential side is smaller than other sections.

As is shown in FIG. 21, from the vicinity of the end section on the +Xside of vacuum pipe line 211 c, a branched pipe line 211 d is formed ina state branching downward (to the −X side) and communicating with theoutside of the first member 103.

As is shown in FIG. 17, the second member 105 has a first supportsection 104 a that has a rough rectangular solid shape and a pair ofsecond axis sections 104 b and 104 c that each integrally project in theZ-axis direction on the vertical surface (the surface on the +Z side) ofthe first support section 104 a.

In the first support section 104 a, a through hole 105 a is formed thatreaches the edge surface on the −X side from the edge surface on the +Xside, and the first member 103 is inserted into through hole 105 a. Asis shown in FIGS. 17, 20, and 21, on the inner circumferential surfaceof through hole 105 a of the first support section, seven groovesections 105 b ₁ to 105 b ₇ are formed corresponding to the sevenbranched pipe lines 211 b ₁ to 211 b ₇ formed in the first member 103.Further, on the inner circumferential surface of through hole 105 a ofthe first support section, a groove section 105 c is formedcorresponding to branched pipe line 211 d formed on the vacuum pipe line211 c side in the first member 103.

As is shown in FIG. 17, in one of the second axis sections 104 b (theone positioned at the +Z side), surface throttle grooves 114 a areformed. Surface throttle grooves 114 a is configured of a first grooveformed along the outer circumferential surface of the second axissection 104 b and a plurality of second grooves that extend in theZ-axis direction formed at a predetermined spacing along the outercircumferential surface of the second axis section 104 b in a statecommunicating with the first groove. Otherwise being verticallysymmetric with the second axis section 104 b, the other second axissection 104 c (the one positioned at the −Z side) is also configured inthe same manner, and surface throttle grooves 114 b are formed on theouter circumferential surface.

As is shown in FIGS. 20 and 21, inside the second member 105, a throughhole 105 d is formed communicating with groove section 105 b ₁ from thecenter of the upper end surface (the +Z edge surface) of the second axissection 104 b. The diameter of the section in the vicinity of the lowerend section communicating with groove section 105 b ₁ is formed smallerthan other sections.

Further, in the second member 105, a through hole 105 c is formed in astate penetrating the second member 105 from the center of the lower endsurface (the −Z edge surface) of the second axis section 104 b toopening 105 a. The diameter of through hole 105 c in the vicinity of theupper end section communicating with groove section 105 c is set smallerthan other sections.

As is shown in FIG. 17, the third member 107 has a second supportsection 108 a that has a rectangular solid outer shape in which arectangular opening (almost a square) 107 a penetrating the third member107 from the surface on the +X side to the surface on the −X side isformed, and a pair of third axis sections 108 b and 108 c that eachintegrally project on the surface on both sides in the X-axis direction(the surface on the +X side) of the second support section 108 a. On theouter circumferential surface of the third axis sections 108 and 108 c,surface throttle grooves 109 a and 109 b are respectively formed.

As is shown in FIGS. 20 and 21, in the second support section 108 a, acircular opening 107 b whose axial direction is in the verticaldirection is formed in the upper wall surface of opening 107 a, and ahollow section communicating with the upper end of circular opening 107b is formed inside the second support section 108 a. In the modifiedexample, the second axis section 104 b previously described is insertedinto circular opening 107 b from below, and in this inserted state, apredetermined clearance is formed between the second axis section 104 band the inner circumferential surface of circular opening 107 b.Further, in the state shown in FIGS. 20, 21 and the like where thesecond axis section 104 b is inserted into circular opening 107 b, aspace 80 that serves as a gas chamber 80 is formed on the upper side ofthe second axis section 104 b inside the second support section 108 a.In the description below, space 80 will also be referred to as gaschamber 80.

Further, as is shown in FIGS. 20 and 21, in the second support section108 a, a circular opening 107 c whose axial direction is in the verticaldirection is formed in the lower wall surface of opening 107 a, and ahollow section communicating with the lower end of circular opening 107c is formed inside the second support section 108 a. In the modifiedexample, the second axis section 104 c previously described is insertedinto circular opening 107 c from above, and in this inserted state, apredetermined clearance is formed between the second axis section 104 cand the inner circumferential surface of circular opening 107 c.Further, in the state shown in FIGS. 20, 21 and the like where thesecond axis section 104 c is inserted into circular opening 107 c, aspace 81 that serves as a vacuum chamber 81 is formed on the lower sideof the second axis section 104 c inside the second support section 108a. In the description below, space 81 will also be referred to as vacuumchamber 81.

As is shown in FIG. 21, inside one of the third axis sections 108 b ofthe third member 107, gas paths 107 f and 107 h are formed spaced apartvertically at a predetermined distance, and inside the other third axissection 108 c, gas paths 107 g and 107 i are formed spaced apartvertically at a predetermined distance. Gas paths 107 f and 107 g eachcommunicate with gas chamber 80 via gas pipe lines 107 j and 107 kextending in the Z-axis direction. Further, gas paths 107 h and 107 ieach communicate with vacuum chamber 81 via gas pipe lines 107 n and 107o that extend in the Z-axis direction. Further, in the third axissection 108 b, a gas pipe line 107 l that communicates gas path 107 fand the outside of the outer circumferential surface of the third axissection 108 b and a gas pipe line 107 p that communicates gas path 107 hand the outside of the outer circumferential surface of the third axissection 108 c are formed. Further, in the third axis section 108 c, agas pipe line 107 m that communicates gas path 107 g and the outside ofthe outer circumferential surface of the third axis section 108 c and agas pipe line 107 q that communicates gas path 107 i and the outside ofthe outer circumferential surface of the third axis section 108 c areformed.

As is shown in FIG. 17, the fourth member 111 is made of a hollow memberthat is vertically open having a rectangular frame shape in a planarview (when viewed from above), and in the wall on both sides in theX-axis direction, circular openings of a first diameter 111 b and 111 care each formed, and in the wall on both sides in the Y-axis direction,circular openings of a second diameter (larger than the first diameter)111 d and 111 e are formed.

As is obvious from FIG. 21, the third axis sections 108 b and 108 c areinserted into circular openings 111 d and 111 e, respectively.Meanwhile, into the remaining two circular openings 111 b and 111 c, thefirst member 103 is inserted with a predetermined gap in between.

As is shown in FIGS. 17 and 21, on the lower side of the inner wallsurface of circular opening 111 e of the fourth member 111 at theposition facing gas pipe line 107 q previously described, a vacuum pipeline 111 f is formed that communicates vertically. Further, as is shownin FIG. 21, on the lower side of the inner wall surface of circularopening 111 d of the fourth member 111, a depressed section 111 g isformed at the position facing gas pipe line 107 p previously described.Depressed section 111 g and vacuum pipe line 111 are in a communicatingstate via a gas pipe line 111 h (refer to FIG. 20) formed inside thefourth member 111. As is shown in FIG. 17, to vacuum pipe line 111 f, aconnecter 115 arranged on the lower surface side of the fourth member isconnected.

Further, on the lower side of the inner wall surface of circular openingat the position facing gas pipe line 107 m previously described, a gassupply pipe line 111 i is formed that communicates vertically, and aconnecter 116 arranged on the upper surface side of the fourth member111 is connected to gas supply pipeline 111 i, as is shown in FIGS. 17and 21.

As is shown in FIG. 22, power usage supply unit 155′ that has theconfiguration described above is attached to counter mass 30 and waferstage WST in a state where both ends of the first member 103 in thelongitudinal direction are connected to the side walls of counter mass30 on both sides in the X-axis direction and the upper end section ofthe third member is connected to the bottom section of wafer stage mainbody 28. And, in the state after the attachment is completed, connecter115 previously described is connected to a vacuum chuck that constituteswafer holder 25 arranged on wafer stage WST via a vacuum piping (notshown), and connecter 116 previously described is connected to a gassupply pipe line (not shown) inside wafer stage main body 28 via apiping (not shown).

Next, the operation of power usage supply unit 155′ configured in themanner described above will be described, referring to FIGS. 20 and 21.In FIGS. 20 and 21, the outlined arrows indicate the gas flow due to thesupply of pressurized gas, and the black arrows indicate the gas flowcaused by the vacuum suction (vacuum).

When the pressurized gas is supplied from gas supply unit 201 into gassupply pipe line 211 a inside the first member 103 via a supply pipe(not shown) and connecter section 103 a connecting to counter mass 30 asis indicated by arrow A in FIG. 20, the pressurized gas flows (rises) inthe direction indicated by arrow B within branched pipe line 211 b ₁,and the pressurized gas also flows within the other branched pipe lines211 b ₂ to 211 b ₇ in the direction indicated by arrow B toward theoutside of the outer circumferential surface of the first member 103 asis shown in FIG. 21. Then, most of the pressurized gas that flows withinbranched pipe line 211 b ₁ flows in the direction indicated by arrow Din through hole 105 d and is supplied to gas chamber 80 previouslydescribed, and the remaining gas flows in the direction indicated byarrow C within groove section 105 b ₁ formed in the second member 105 asis shown in FIG. 20, and the pressurized gas is filled into the spacemade with groove section 105 b ₁ and the first member 103. Further, alsoin groove sections 105 b ₂ to 105 b ₇, pressurized gas flows in the samedirection as arrow C, and the pressurized gas is filled into the spacemade with groove sections 105 b ₂ to 105 b ₇ and the first member 103.And, the pressurized gas also flows within surface throttle grooves 103b formed on the surface of the first member 103. In this case, similarto the first embodiment previously described, the first member 103 issupported in a non-contact manner with respect to the first supportsection 104 a of the second member 105 by the static pressure of thepressurized gas in the gap between surface throttle grooves 103 b andthe second member 105. That is, in the manner described above, a type ofstatic gas bearing is configured in the entire area of surface throttlegrooves 103 b. As a consequence, the first member 103 is in a statewhere movement in the X-axis direction and the rotational directionaround the X-axis of the first member 103 with respect to the firstsupport section 104 a is permissible.

Meanwhile, the inside of gas chamber 80 is filled with the pressurizedgas supplied in the manner previously described, and a part of thepressurized gas that is filled flows (leaks) in the direction indicatedby arrow E in the extremely small gap between opening 107 b formed inthe third member 107 (the second support section 108 a) and the secondaxis section 104 b of the second member 105 as is shown in FIG. 20.Accordingly, as is previously described, a type of static gas bearing isconfigured in the entire area of surface throttle grooves 114 a formedin the second axis section 104 b, and the second axis section 104 b isin a state where movement in the Z-axis direction and the rotationaldirection around the Z-axis of the second axis section 104 b withrespect to the second support section 108 a is permissible.

As is shown in FIG. 21, a part of the pressurized gas filled inside gaschamber 80 flows in the direction indicated by arrow F (the −Zdirection) within gas pipe lines 107 j and 107 k, sequentially goesthrough gas paths 107 f and 107 h and gas pipe lines 107 l and 107 m andflows out into a gap, which is formed with the fourth member 111 outsidethe third axis sections 108 b and 108 c of the third member 107. Thepressurized gas flows within surface throttle grooves 109 a and 109 b(refer to FIG. 17) formed in the third axis sections 108 b and 108 c ofthe third member 107, respectively. Accordingly, as is previouslydescribed, a type of static gas bearing is configured in the entire areaof surface throttle grooves 109 a and 109 b formed in the third axissections 108 b and 108 c, respectively, and the third axis sections 108b and 108 c are in a state where movement in the Y-axis direction andthe rotational direction around the Y-axis of the third axis sections108 b and 108 c with respect to the fourth support member 111 ispermissible.

Further, the pressurized gas that flows outside the third axis section108 c via gas pipe line 107 m is sent to the inside of wafer stage mainbody 28 via gas supply pipe line 111 i formed in the fourth member 111facing gas pipe line 107 m, and is supplied, for example, to self-weightcanceller 101 previously described, as well as to the elevatingmechanism (not shown) that elevates vertical movement pins (center-ups)arranged in wafer holder 25 for elevating wafer W.

When vacuum operation by vacuum suction unit 202 begins and negativepressure is generated, the negative pressure is supplied to vacuum pipeline 211 c via a vacuum pipe connecting to connecter section 103 c ofthe first member 103, and a gas flow indicated by arrow A′ in FIG. 20occurs in vacuum pipe line 211 c. By the negative pressure caused by thegas flow, the gas inside vacuum chamber 81 is suctioned to the vacuumpipe line 211 c side, and a gas flow indicated by arrow D′ in FIG. 20occurs inside through hole 105 e, as well as a gas flow indicated byarrow C′ in FIG. 20 occurs in the space formed by the first member 103and groove 105 c formed in the second member 105. And by the latter gasflow, the pressurized gas that flows out into the gap between the firstmember 103 and the second member 105 via grooves 105 b ₁ to 105 b ₇ issuctioned along surface throttle grooves 104 b of the first member 103and the pressurized gas smoothly spreads to the entire circumference ofsurface throttle grooves 104 b as is previously described, and thepressurized gas that reaches groove 105 c is also recovered.

The gas flow indicated by arrow D′ in FIG. 20 that occurs inside throughhole 105 e described above creates negative pressure (vacuum state) invacuum chamber 81, and by the negative pressure, a gas flow occurs inthe direction indicated by arrow E′ in the space formed by the secondaxis section 104 c of the second member 105 and the third member 107(the second support section 108 a) as is shown in FIGS. 20 and 21, andby the gas flowing within surface throttle grooves 114 b formed in thesecond axis section 104 c, a type of static gas bearing is configured inthe entire area of surface throttle grooves 114 b, and the second axissection 104 c is in a state where movement in the Z-axis direction andthe rotational direction around the Z-axis of the second axis section104 c with respect to the second support section 108 a is permissible.Accordingly, power usage supply unit 155′ of the modified example has aconfiguration in which the position and attitude in directions of sixdegrees of freedom can be changed.

Further, by the negative pressure inside vacuum chamber 81, the gasinside gas paths 107 f and 107 h are suctioned to vacuum chamber 81, anda gas flow indicated by arrow F′ in FIG. 21 occurs in gas pipe lines 107n and 107 o. This gas flow creates negative pressure inside gas paths107 f and 107 h, and by the negative pressure, a gas flow indicated byarrow G′ in FIG. 21 occurs inside vacuum pipe line 111 f formed in thefourth member 111 as well as inside depressed section 111 gcommunicating with vacuum pipe line 111 f via gas pipe line 111 h, and agas flow indicated by arrow H′ in FIG. 21 also occurs in the gap betweencircular opening 111 d of the fourth member 111 and the third axissection 108 b and the gap between circular opening 111 c and the thirdaxis section 108 c. And by the latter gas flow, the pressurized gas thatflows out into the gap between circular opening 111 d and the third axissection 108 b and the gap between circular opening 111 c and the thirdaxis section 108 c from gas pipe lines 107 l and 107 m, respectively, issuctioned along surface throttle grooves 109 a and 109 b of the thirdaxis sections 108 b and 108 c and the pressurized gas smoothly spreadsto the entire circumference of surface throttle grooves 109 a and 109 b,and the pressurized gas that reaches the lowest section of surfacethrottle grooves 109 a and 109 b is also recovered.

By the gas flow indicated by the arrow G′, negative pressure is createdinside vacuum pipe line 111 f, and by the negative pressure, a gas flowoccurs indicated by arrow I′ in FIG. 21 in the vacuum pipe connectingthe vacuum chuck of wafer holder 25 and the-fourth member 111, and waferW is suctioned by vacuum chucking.

As is described above, power usage supply unit 155′ of the modifiedexample has six degrees of freedom, and because fluid (pressurized gas)supply can be performed via the counter mass according to power usagesupply unit 155′, the same effects as in the second embodimentpreviously described can be obtained.

Also in the modified example above, an arrangement that employs a tubecarrier as in the first embodiment can be employed.

In the modified example above, the fourth member 111 of power usagesupply unit 155′ does not have to be arranged. In this case, althoughthe degrees of freedom of the power usage supply unit will be fourdegrees of freedom, a highly precise stage control can be performed whencompared with the case where piping (tubes) are employed.

In each of the embodiments above and in the modified example, the casehas been described where the stage unit of the present invention isemployed in a wafer stage unit, however, the stage unit can also beemployed in a reticle stage unit that includes reticle stage RST.

In each of the embodiments above and in the modified example, the casehas been described where the present invention is applied to a scanningstepper, however, the scope of the present invention is not limited tothis, and the present invention can also be suitably applied to a statictype exposure apparatus such as a stepper that performs exposure in astate where the mask and the substrate are static. Further, the presentinvention can also be suitably applied to an exposure apparatus by thestep-and-stitch method.

The object serving as the subject for exposure of the exposure apparatusis not limited to a wafer for manufacturing semiconductors as in theembodiments above, and it can also be a square shaped glass plate formanufacturing display units such as a liquid crystal display, a plasmadisplay, and an organic EL, a thin film magnetic head, an imaging device(such as CCDs), and a substrate for manufacturing a mask or a reticle.

Further, in each of the embodiments above and in the modified example,as illumination light IL of the exposure apparatus, the light is notlimited to light having the wavelength equal to or greater than 100 nm,and it is needless to say that light having the wavelength less than 100nm can also be used. For example, in recent years, in order to expose apattern equal to or less than 70 nm, development is performed of an EUVexposure apparatus that makes an SOR or a plasma laser as a light sourcegenerate an EUV (Extreme Ultraviolet) light in a soft X-ray range (suchas a wavelength range from 5 to 15 nm), and uses a total reflectionreduction optical system designed under the exposure wavelength (such as13.5 nm) and the reflective type mask. Furthermore, for example, thepresent invention can also be suitably applied to an immersion exposureapparatus that has liquid (e.g. pure water or the like) filled inbetween projection optical system PL and a wafer whose details aredisclosed in, for example, the pamphlet of International PublicationWO99/49504 and the like.

Further, the present invention can also be applied to an exposureapparatus that uses a charged particle beam such as an electron beam oran ion beam. Incidentally, the electron beam exposure apparatus can bean apparatus by any one of a pencil beam method, a variable-shaped beammethod, a self-projection method, a blanking aperture array method, anda mask projection method.

The stage unit related to the present invention can be applied not onlyto an exposure apparatus, but can also be widely applied to othersubstrate processing units (e.g. a laser repair unit, a substrateinspection unit or the like), or to a position unit of a sample in otherprecision machinery, a wire bonding apparatus or the like.

The exposure apparatus related to the present invention such as exposureapparatus 100 or the like in the embodiments described above can be madeby incorporating an illumination unit made up of a plurality of lenses,a projection optical system and the like into the main body of theexposure apparatus, and then performing optical adjustment. Then, partsdescribed above such as the X-axis stator, the X-axis mover, the Y-axisstator, the wafer stage, the reticle stage, and other various parts arealso mechanically and electrically combined and adjusted. And then,total adjustment (such as electrical adjustment and operation check) isperformed, which completes the making of the exposure apparatus. Theexposure apparatus is preferably built in a clean room where conditionssuch as the temperature and the degree of cleanliness are controlled.

Semiconductor devices are manufactured through the following steps: astep where the function/performance design of a device is performed; astep where a reticle based on the design step is manufactured; a stepwhere a wafer is manufactured using materials such as silicon; alithography step where the pattern formed on the mask is transferredonto a photosensitive object by the exposure apparatus described in theembodiments above; a device assembly step (including processes such asdicing process, bonding process, and packaging process); inspectionstep, and the like. In this case, in the lithography step, because theexposure apparatus in the embodiments above is used, high integrationdevices can be manufactured with good yield.

INDUSTRIAL APPLICABILITY

As is described above, the stage unit in the present invention issuitable for making the stage move along a movement surface. Further,the exposure apparatus and the exposure method are suitable for forminga pattern by exposing a substrate.

1. A stage device that has a stage which moves on a movement surface anda power usage supply unit which supplies power usage to the stagewherein the power usage supply unit comprises: a first axis section thatextends in a direction of a first axis within the movement surface; afirst support section that movably supports the first axis section inthe direction of the first axis and around the first axis; a second axissection that extends in a direction of a second axis intersecting withthe first axis; and a second support section that movably supports thesecond axis section in the direction of the second axis and around thesecond axis.
 2. The stage device of claim 1 wherein the power usagesupply unit further comprises: a third axis section that extends in adirection of a third axis intersecting with the first axis and thesecond axis; and a third support section that movably supports the thirdaxis section in the direction of the third axis and around the thirdaxis.
 3. The stage device of claim 2 wherein between the first axissection and the first support section, the second axis section and thesecond support section, and the third axis section and the third supportsection, a first, second, and third static gas bearings are arranged,respectively.
 4. The stage device of claim 1 wherein the power usagesupply unit is arranged in a carrier that moves in a constant speedalong the direction of the first axis.
 5. The stage device of claim 1wherein between the first axis section and the first support section,and the second axis section and the second support section, first andsecond static gas bearings are arranged, respectively.
 6. The stagedevice of claim 1 wherein the power usage supply unit has a suctionunit.
 7. The stage device of claim 6 wherein the suction unit suctionsliquid on the stage.
 8. The stage device of claim 1, the unit furthercomprising: a drive unit that drives the stage, wherein the power usagesupply unit supplies the drive unit a temperature adjustment fluid usedto adjust the temperature of the drive unit.
 9. The stage device ofclaim 8 wherein the drive unit has a magnet arranged in the openingsection of the stage.
 10. The stage device of claim 1 wherein the stagedevice has a plurality of power usage supply units. 11-22. (canceled)23. An exposure apparatus that transfers a pattern of a mask mounted ona stage device onto a substrate wherein a stage device according toclaim 1 is used as the stage device.
 24. An exposure apparatus thatforms a pattern by exposing a substrate mounted on a stage devicewherein a stage device according to claim 1 is used as the stage device.25. A device manufacturing method that includes a lithography process inwhich a device pattern is transferred onto a substrate using theexposure apparatus according to claim
 23. 26. A device manufacturingmethod that includes a lithography process in which a device pattern isformed by exposing a substrate using the exposure apparatus according toclaim
 24. 27. A stage device, the unit comprising: a stage movablysupported on a movement surface; a first drive unit that drives thestage; a counter mass that moves in an opposite direction of the stageby the reaction force caused when the first drive unit drives the stage;and a power usage supply unit that supplies power usage to the stage viathe counter mass.
 28. The stage device of claim 27 wherein the movementsurface is formed on the counter mass.
 29. The stage device of claim 27,the unit further comprising: a second drive unit that drives the countermass.
 30. The stage device of claim 27 wherein the power usage supplyunit comprises a movement section that moves corresponding to themovement of the stage.
 31. An exposure apparatus that transfers apattern of a mask mounted on a stage device onto a substrate wherein astage device according to claim 27 is used as the stage device.
 32. Anexposure apparatus that forms a pattern by exposing a substrate mountedon a stage device wherein a stage device according to claim 27 is usedas the stage device.
 33. A device manufacturing method that includes alithography process in which a device pattern is transferred onto asubstrate using the exposure apparatus according to claim
 31. 34. Adevice manufacturing method that includes a lithography process in whicha device pattern is formed by exposing a substrate using the exposureapparatus according to claim
 32. 35. An exposure method in which apattern is formed by exposing a substrate on a stage with a unitcomprising a power usage supply unit that supplies power usage to thestage which moves within a two dimensional plane wherein the power usagesupply unit is moved in a first axis direction within the twodimensional plane and also around the first axis, and the power usagesupply unit is moved in a second axis direction intersecting with thefirst axis and also around the second axis.
 36. The exposure method ofclaim 35 wherein the power usage supply unit substantially does notprovide any resisting force to the stage.
 37. The exposure method ofclaim 35 wherein the power usage supply unit moves in a third axisdirection intersecting with the first axis direction and the second axisdirection and also around the third axis.
 38. The exposure method ofclaim 35 wherein the power usage supply unit suctions liquid on thestage.
 39. The exposure method of claim 38 wherein the suction of theliquid is performed after completion of an exposure operation.
 40. Theexposure method of claim 35 wherein the power usage supply unit suppliesa drive unit that drives the stage a temperature adjustment fluid usedto adjust the temperature of the drive unit.
 41. A device manufacturingmethod that includes a lithography process in which a device pattern isformed by exposing a substrate using the exposure method according toclaim
 35. 42. A stage device, the device comprising: a stage relativelymovable with respect to a movement surface in four or more degrees offreedom; and a power usage supply unit that supplies power usage to thestage wherein the power usage supply unit includes a moving section thathas a supply member which supplies the power usage and is relativelymovable to the movement surface independent from the stage; a first unitthat has a first member movable in a direction of a first axis and asecond member that has a section opposing the first member and canrelatively move with respect to the first member in at least two or moredegrees of freedom including the direction of the first axis as onedegree of freedom, and performs the delivery of the power usage betweenthe first member and the second member; and a second unit arrangedbetween the moving section and the second member that allows relativemovement between the moving section and the second member in directionsof remaining directions of freedom when the at least two degrees areexcluded from the four degrees of freedom, and performs the delivery ofthe power usage between the supply member and the second member.
 43. Thestage device of claim 42 wherein the stage relative moves in six degreesof freedom with respect to the movement surface, and the first memberand the second member relatively moves in two degrees of freedom. 44.The stage device of claim 42 wherein a first static gas bearing isarranged in the opposing section between the first member and the secondmember.
 45. The stage device of claim 42 wherein the moving section isarranged with a carrier that constantly moves along a direction of thefirst axis.
 46. The stage device of claim 42 wherein the first member isfixed to the stage.
 47. The stage device of claim 42 wherein the firstmember includes a first axis section that extends in a direction of thefirst axis, and the second member includes a first support section thatmovably supports the first axis section in a direction of the first axisand the direction around the first axis whereby the second unit includesa second axis section that extends in a direction of a second axisintersecting the first axis and a second support section that movablysupports the second axis section in a direction of the second axis andthe direction around the second axis.
 48. The stage device of claim 47wherein the second unit further includes a third axis section thatextends in a direction of a third axis intersecting the first axis andthe second axis and a third support section that movably supports thethird axis section in a direction of the third axis and the directionaround the third axis.
 49. An exposure apparatus that transfers apattern of a mask mounted on a stage device onto a substrate wherein astage device according to claim 42 is used as the stage device.
 50. Anexposure apparatus that forms a pattern by exposing a substrate mountedon a stage device wherein a stage device according to claim 42 is usedas the stage device.
 51. A device manufacturing method that includes alithography process in which a device pattern is transferred onto asubstrate using the exposure apparatus according to claim
 49. 52. Adevice manufacturing method that includes a lithography process in whicha device pattern is formed by exposing a substrate using the exposureapparatus according to claim 50.